Miradia Inc.

Other

Utica Leaseco, LLC

Howard Woo

Xiao Charles Yang

Yuxiang May Wang

Ye Wang

Justin Allen Payne

Wook Ji

Vlad Joseph Novotny

William Spencer Worley, Iii

Dongmin Chen

Jonathan David Mohn

Brian K McGinley

Brendan M Kayes

Kegang Huang

Christopher Earl France

Vineet Kumar

Katayoun Zand

Markelle L Gibbs

Enrique Bravo Mora

Aspects of the present disclosure include methods, apparatuses, and computer readable media for transmitting a light such that it is incident on a multi-layer stack, wherein the multi-layer stack includes the feature and a region without the feature, detecting a narrow-band light from the feature and the region without the feature, wherein the feature has a first optical response in response to a wavelength of the narrow-band light and the region without the feature has a second optical response in response to the wavelength of the narrow-band light, and generating, based on the narrow-band light, an image indicative of where the first optical response and the second optical response occur on the multi-layer stack.

Methods and systems for identifying features

Readout integrated circuits placed underneath the suspended sensing elements detect changes of electrical resistance of sensing elements and digitize the signals with digital to analog convertor for each element. Readout electronics provides low parasitics, high signal to noise ratio, high data rate, high dynamic range and instantaneous global readout.

Infrared imager readout electronics

The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance. Array of individually sealed, suspended micro-elements is combined with signal processing chip that contains nonvolatile memory with sensitivity calibration of all elements and interpolation between non-functional elements. When the micro-elements are infrared light absorbers, image analysis and recognition is embedded in the processing chip to form the infrared imaging solution for infrared cameras.

Sealed infrared imagers

A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300&#xb0; C. to maintain a state of the planarizing material.

Fabrication of a high fill ratio silicon spatial light modulator

A method of manufacturing bonded substrate structures. The method includes providing a first substrate comprising a first surface region and processing the first surface region to form a first pattern region using a first photolithographic stepper characterized by a first tolerance criteria for alignment. The method also includes providing a second substrate comprising a second surface region and processing the second surface region through at least one masking process to form a second pattern region using a second photolithographic stepper characterized by a second tolerance criteria for alignment. Further, the method includes determining a masking process having a third tolerance criteria for alignment, the third tolerance criteria allowing for a change from the second to the first photographic stepper, processing the second substrate for at least the determined masking process using the first photolithographic stepper, and joining the first substrate to the second substrate to form a composite substrate structure.

Method and structure for manufacturing bonded substrates using multiple photolithography tools

A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300 &#xb0; C. to maintain a state of the planarizing material.

An optical deflection device for a display application. The optical deflection device includes a semiconductor substrate including an upper surface region and one or more electrode devices provided overlying the upper surface region. The optical deflection device also includes a hinge device including a silicon material and coupled to the upper surface region. The optical deflection device further includes a spacing defined between the upper surface region and the hinge device and a mirror structure including a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion and overlying the hinge device.

High fill ratio silicon spatial light modulator

A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.

Projection display system including a high fill ratio silicon spatial light modulator

Hydrogen cleave silicon process for light modulating mirror structure using single crystal silicon as the base cross-member. Existing processes use two critical alignment steps that can contribute to higher actuation voltages and result in lower manufacturing yields. The hydrogen cleave process simplifies the manufacturing process to one step: transferring a thin film of single crystal silicon to the CMOS substrate, resulting in minimal alignment error and providing large bonding area.

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San Jose, CA, United States of America

Howard Woo