International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Howard Victor Mahaney, Jr

John Saunders Corbin, Jr

Jose Arturo Garza, Jr

Dales Morrison Kent

Kenneth Carl Larsen

John Joseph Salazar

Hoa Thanh Phan

Roger R Schmidt

Prabjit Singh

Sukhvinder Singh Kang

William James Anderl

David Peter Gaio

William K Hogan

Scott Michael Branch

Michael Francis Hanley

David Paul Barron

Phillip V Mann

Eric Alan Eckberg

Paul Andrew Wormsbecher

Michael Raymond Miller

Gregory Joseph McKnight

Johnny Roy Brezina

Daniel Paul Beaman

Matthew Tant Richardson

James Robert Taylor

Frederic William Wright, Iv

Lonnie J Cannon

Madhusudan K Iyengar

Michael A Gaynes

Mark Vincent Pierson

Vinod Kamath

David Lewis Gardell

Scott Alan Shurson

Stephen Peter Mroz

Bruce James Wilkie

Michael Sven Miller

William M Megarity, Jr

Benjamin W Mashak

Robert F Florence, Jr

Steven Michael Christensen

Tejas Shah

Alan Claassen

George Zacharakis-Jutz

Rachael C Freitas

Dennis John Hansen

Jeffrey Frank Kutner

A system for cooling a heat generating enclosure includes a first array of one or more fans of a first size and a second array of one or more fans of a second size, where the second array is in series to the first array. The system also includes a measuring unit configured to measure at least one process variable. The system also includes a control unit configured to control at least one of the fans in the first array or at least one of the fans in the second array based on the process variable, wherein the fans are controlled to achieve an optimization criterion.

Parallel-series hybrid fan cooling apparatus and optimization

Cooling systems employing adjacent fan cages having cage walls with interflow passages are disclosed. A cooling system includes cooling fans disposed in adjacent fan cages. Cage walls of the fan cages direct flows from the fans to the outlet ports of the fan cages which are in fluid communication with electrical components within an electronics-containing enclosure. By forming an interflow passage between the adjacent fan cages, upon occurrence of an inoperable fan, a portion of the flow from an adjacent operable fan can pass to the outlet port of the fan cage of the inoperable fan via the passage and provide better cooling of the components impacted by the inoperable fan. In this manner, thermal damage is avoided while minimizing fan noise associated with higher fan speeds.

Cooling system for electronic devices employing adjacent fan cages with interflow passages

A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening.

Container-based data center having greater rack density

A method is provided which includes providing a heat exchanger door that includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure.

Structural configuration of a heat exchanger door for an electronics rack

Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.

Rack with integrated rear-door heat exchanger

Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Functional and stress testing of LGA devices

A method of cooling an optical transceiver that is mountable in a wall opening and a method of cooling a data transfer system in combination with an optical transceiver is described. An optical transceiver is provided that has a form factor and one end portion that is insertable within a wall opening in a wall. Ambient air is ventilated over a major surface portion of the optical transceiver by mounting said end portion to the wall opening so that at least one vent is formed within confines of the wall opening. The vent allows air to pass between the exterior and interior of the enclosure, and over the major surface portion of the optical transceiver.

Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods therefor

Growing community of inventors

Cedar Park, TX, United States of America

Howard Victor Mahaney, Jr