Northrop Grumman Systems Corporation

Howard N Fudem

Li-shu Chen

Philip C Smith

Gregory R Dietz

Sanjay B Moghe

Thomas J Moloney

John Xavier Przybysz

Robert Miles Young

John D Adam

Frank A Lindberg

Lawrence E Dickens

Hong Zhang

Don E Crockett

Gregory DeSalvo

Fred E Sacks

William E Hall

Donald E Crockett

An RF mixer includes a diode quad including first, second, third and fourth carbon nanotube diodes, each carbon nanotube diode including a p-n junction The mixer also includes a RF input coupled each of the diodes, and a local oscillator input coupled with each of the diodes.

Carbon nanotube devices and method of fabricating the same

A wide dynamic range mixer which has a high linearity passive balun fabricated on a Si substrate for receiving an input RF signal and an active balun for receiving a local oscillator signal. The active balun includes high frequency, low voltage SiGe transistors to achieve low power amplification of the local oscillator signal. The output signals of the baluns are provided to a non-linear diode quad mixer device which provides a desired IF signal.

High dynamic range mixer apparatus and balun therefor

A plurality of electronic circuits and associated signal lines are positioned at respective locations on a base wafer. A cover wafer, which fits over the base wafer, includes a corresponding like number of locations each including one or more cavities to accommodate the electronic circuit and associated signal lines. The cover wafer includes a plurality of vias for making electrical connection to the signal lines. A multi layer metallic arrangement hermetically seals the periphery of each location as well as sealing the bottom of each via. The joined base and cover wafers may then be diced to form individual die packages.

Wafer scale package and method of assembly

A capacitive type MEMS switch having a conductor arrangement comprised of first and second RF conductors deposited on a substrate. A bridge member having a central enlarged portion is positioned over the conductor arrangement. In one embodiment, the first RF conductor has an end defining an open area in which is positioned a pull down electrode, with the end of the first RF conductor substantially surrounding the pull down electrode. In another embodiment, two opposed RF conductors, each having ends with first and second branches, define an open area in which a pull down electrode is positioned. A dielectric layer is deposited on the conductor arrangement such that when a pull down voltage is applied to the pull down electrode, the switch impedance is significantly reduced so as to allow signal propagation between the RF conductors.

Capacitive type microelectromechanical RF switch

A MEMS switch having spaced-apart RF conductors on a substrate with a bridge structure disposed above the substrate. In one embodiment the bridge structure has two flexible arms supported by two support members and in another embodiment the bridge structure has three flexible arms supported by three support members, the third support member being electrically integral with the second conductor. The bridge structure is drawn down to effect electrical contact between the first and second conductors by application of a control signal to a control electrode, having an opposed electrode on the undersurface of the bridge structure. A central stiffener portion of the bridge prevents any contact between the control and opposed electrodes.

Microelectromechanical RF switch

A footprint for adaptable MMIC arrays is disclosed in which the size, number and location of the array components is optimized for the fabrication by depositing a personalizing metal interconnecting layer on the array, of essentially any MMIC circuit from a single footprint layout.

Adaptable MMIC array

Mini-microstrip and mini-coplanar transmission lines are formed on a ship substrate with two metal layers. Together with a ground plane on the underside of the substrate, the lines are connected to form a Marchand balun. Two baluns, a quarter-wave transmission line and a diode quad are combined on a chip to form an MMIC mixer, and a par of mixers are combined with 90.degree. and 180.degree. splitters to provide circuits with superior rejection of specific spurious signals as well as RF and LO leakage over.

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Baltimore, MD, United States of America

Howard N Fudem