Intel Corporation

Howard L Heck

Khang Choong Yong

Stephen R Mooney

James E Jaussi

Huimin Chen

Bryan K Casper

Wil Choon Song

Bryce D Horine

Bok Eng Cheah

Jackson Chung Peng Kong

Gary A Brist

Stephen H Hall

Su Sin Florence Phun

Tao Liang

Robert A Dunstan

Frank T Hady

Andrew W Martwick

Kuan-Yu Chen

Jingbo Li

Dennis Bell

Bruce E Pederson

Abdul Rahman Ismail

Stephen H Hall, Jr

Kai Wang

Kai Xiao

Kooi Chi Ooi

Nausheen Ansari

Zuoguo Wu

Harry G Skinner

Xiang Li

Debabani Choudhury

Jenny Shio Yin Ong

Seok Ling Lim

Lakshminarayana Pappu

Michael W Leddige

Hao-Han Hsu

Karthi R Vadivelu

Chung-Hao Chen

Tao Xu

Xiaoning Ye

Yun Ling

Jong-Ru Guo

Amit Kumar Srivastava

Yun Ji

Pujitha Davuluri

Michael T White

Hsiao-Ping Tsai

Steve Y Chang

Abdul Hawk Ismail

Teong Keat Beh

Yang Wu

Shu Young Cheah

Jackson Kong

Will Choon Song

Marko Balogh

Chung-hao J Chen

Kuan-yu Chen

Embodiments relate to a controller subsystem that includes a virtual reality (VR) subsystem to: identify data received from a peripheral device as related to an audio/visual (A/V) function of the peripheral device; direct, based on the identification that the data is related to the A/V function of the peripheral device, the data to be stored in a memory subsystem of the controller subsystem; and facilitate transmission of an indication of a storage location of the data in the memory subsystem to a host system that is communicatively coupled with the controller subsystem. The controller subsystem further includes a graphics engine to: identify, in a message received from the host system based on the transmission of the indication of the storage location of the data, instructions related to rendering the data; and generate, based on the data received from the peripheral device, rendered data. Other embodiments may be described and claimed.

Low latency communication path for audio/visual (A/V) applications

An apparatus may comprise a skew detection circuit to sample a common mode voltage of a differential signal, wherein the sampled common mode voltage is indicative of an amount of skew between a first signal of the differential signal and a second signal of the differential signal; and a skew compensation circuit to adjust a delay of the first signal or the second signal based on the sampled common mode voltage to reduce the amount of skew.

Skew detection and compensation for high speed I/O links

In one embodiment, an apparatus includes: a transmitter to receive application-specific data and protocol information and to send the application-specific data and the protocol information to a destination circuit via a link; and a protocol engine coupled to the transmitter, where the protocol engine is to cause the transmitter to send the application-specific data according to a first bit error rate (BER) and send the protocol information according to a second BER, the first BER greater than the second BER. Other embodiments are described and claimed.

System, apparatus and method for communicating with a variable bit error rate

Embodiments of the present disclosure may relate to a controller coupled to a re-driver, where the controller has one or more sensor ports to couple with sensor devices, with circuitry coupled with the sensor ports and a re-driver port to receive operational data from the sensor ports, and based on the received operational data identify an indication of a re-driver equalizer setting to be transmitted to the re-driver device. Embodiments are used to increase the stability of the re-driver and maintain link margins a crossed varied operational conditions of the re-driver. Other embodiments may be described and/or claimed.

Equalizer settings for a re-driver

Methods and systems may provide for a gyratory sensing system (GSS) for extending the human machine interface (HMI) of an electronic device, particularly small form factor, wearable devices. The gyratory sensing system may include a gyratory sensor and a rotatable element to engage the gyratory sensor. The rotatable element may be sized and configured to be easily manipulated by hand to extend the HMI of the electronic device such that the functions of the HMI may be more accessible. The rotatable element may include one or more rotatable components, such as a body, edge or face of a smart watch, that each may be configured to perform a function upon rotation, such as resetting, selecting, and/or activating a menu item.

Gyratory sensing system to enhance wearable device user experience via HMI extension

Techniques for encoding data are described herein. The method includes receiving a block payload at a physical layer to be transmitted via a data bus. The method includes establishing a block header comprising an arrangement of bits, the block header defining two block header types, wherein a hamming distance between block header types is at least four.

Method of encoding data

In accordance with embodiments disclosed herein, there is provided a high-density low-loss cable and connector assembly. A cable assembly includes a first cable connector, a bulk cable section, and a first cable transition section. The bulk cable section includes a first plurality of conductive wires of a first wire thickness. The first cable transition section includes a second plurality of conductive wires that has a first distal end connected to the bulk cable section and a second distal end connected to the first cable connector. Each of the second plurality of conductive wires transitions from the first wire thickness at the first distal end to a second wire thickness that is less than the first wire thickness at the second distal end. Each of the second plurality of conductive wires in the first distal end is connected to a corresponding conductive wire of the first plurality of conductive wires.

High-density low-loss cable and connector assembly

A stiffener includes an integrated cable-header recess that couples a semiconductor package substrate flexible cable. The flexible cable connects to a device on a board without using interconnections that are arrayed through the board. A semiconductive die is coupled to the semiconductor package substrate and flexible cable through the cable-header recess.

Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same

Semiconductor packages including a lateral interconnect having an arc segment to increase self-inductance of a signal line is described. In an example, the lateral interconnect includes a circular segment extending around an interconnect pad. The circular segment may extend around a vertical axis of a vertical interconnect to introduce an inductive circuitry to compensate for an impedance mismatch of the vertical interconnect.

Semiconductor package having inductive lateral interconnects

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Hillsboro, OR, United States of America

Howard L Heck