Other

Xilinx, Inc.

Howard Johnson

Peter Colne Salmon

Romi Mayder

Mark A Alexander

Integrated circuits are fabricated with mounted discrete capacitors. Bond pads and land pads are fabricated on a semiconductor wafer. Discrete capacitors are mounted on the semiconductor wafer with flexible adhesive. The flexible adhesive accommodates a difference in thermal expansion between the discrete capacitors and the semiconductor wafer. The land pads are electrically coupled to the electrodes of the discrete capacitors. The semiconductor wafer is separated into multiple semiconductor dice. The semiconductor dice are mounted in respective packages. The bond pads on each semiconductor die are electrically coupled to the interconnect terminals of the respective package.

Integrated circuit having a discrete capacitor mounted on a semiconductor die

An electronic socket is described for providing either or both temporary and permanent attachments of electronic components to a substrate having interconnection circuits. The socket includes wells filled with a conductive fluid or paste for temporary attachment to the mesas of an electronic circuit. The wells are connected to selected traces of the substrate having interconnection circuits. The temporary connection may be used to produce known good die (KGD), including support of burn-in and high-speed functional test. The mesas can be filled with a material that is hardened after insertion of the mesas for permanent connection of the electronic circuit to the interconnect circuit.

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Twisp, WA, United States of America

Howard Johnson