Trw Limited

Howard E Green

Robert J Jones

Sandra C Quinlivan

Michael K O'Rell

Robert W Vaughan

Howard N Cassey

Polyimide prepolymers formed by thermo-reactions of an aliphatic bismaleimide, where the aliphatic group is a polyaliphatic ether, with an aromatic bismaleimide and/or an aromatic diamine in combination with a trismaleimide which are curable upon addition of an acid catalyst and/or heating to about 65.degree. C.

Low temperature curable compliant bismaleimide compositions

Polyimide prepolymers formed by thermo-reactions of an aliphatic bismaleimide, where the aliphatic group is a polyaliphatic ether, with an aromatic bismaleimide and/or an aromatic diamine in combination with a cross-linking agent having at least two vinyl groups provide compositions which are curable at low temperatures, i.e., 65.degree. C. or less.

End-capping an aromatic diamine or a precursor formed by reaction of an aromatic diamine with an aromatic dianhydride with difluoromaleic anhydride yields prepolymers which thermally cure at temperatures from about 150.degree. to about 200.degree. C. to form polymers which display long-term thermal stability at temperatures up to 300.degree. C. and more.

Bis (difluoromaleimide) capped propolymers and polymers

A low temperature curing polymeric adhesive composition may be made by reacting an amino alcohol having between 1 and 3 amino groups and between 2 and 5 hydroxyl groups with a stoichiometric amount of a carboxylic acid or derivative. Free radical catalysts and accelerators may be added to speed the cure of the adhesive. These adhesive resins can be cured at or near ambient room temperature and are highly desired for fabrication of bonded materials possessing long fatigue life because of reduced stresses that might be induced at higher cure temperatures. A generalized formula may be illustrated as follows: ##EQU1## WHERE R' may be hydrogen, alkyl, or cycloalkyl; R' may be hydrogen or alkyl; R is an alkyl; R.sub.1 may be hydrogen, an alkyl, or phenyl; m is an integer from 1 to 3; and n is an integer from 1 to 2.

Low temperature curing adhesives

A compliant polyimide having superior thermal-mechanical properties can be produced by reacting an aromatic bis(furfurylimide) with an aliphatic ether bis(maleimide) via a Diels-Alder reaction. These polyimides display a long-term thermal-oxidative stability and a high percent recoverable elongation to break, and they are suitable for use as films, fibers, coatings, adhesives, structures, and sealants.

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Seal Beach, CA, United States of America

Howard E Green