E.i. Dupont De Nemours and Company

University of New Mexico

Dowa Electronics Materials Co., Ltd.

University System of Maryland

North Carolina State University

Clarkson University

E. I. Du Pont Nemours and Co.

Solar Paste, LLC

Howard David Glicksman

Haixin Yang

Toivo T Kodas

Michael Stephen Wolfe

Takashi Hinotsu

Dave Hui

Shingo Teragawa

James J Krajewski

Lynda Kaye Johnson

Kurt Richard Mikeska

William J Borland

Gary Delmar Jaycox

Marc Bruce Goldfinger

Kenneth George Sharp

Reid John Chesterfield

Brian J Laughlin

Jeffrey Scott Meth

Graciela Beatriz Blanchet

Feng Gao

Geoffrey Nunes

Irina Malajovich

Richard Kevin Bailey

John W Catron, Jr

Diptarka Majumdar

Eric Lee Brantley

John T Chaplinsky

Lawrence V Triboletti

Adele Amelia Pliscott

Guray Tosun

Mark Andrew Harmer

Paul J Shannon

Elizabeth Forrester McCord

Hong Meng

Rinaldo Soria Schiffino

Karyn B Visscher

Jon-Paul Maria

John James Barnes

Gerald Donald Andrews

Barry Edward Taylor

Roupen Leon Keusseyan

Michael F Barker

Charles Nehemiah McEwen

William J Marshall

Thomas C Felder

Timothy L Ward

Gerard O'Neil

Sheryl Ehrman

Alex Langrock

Daniel V Goia

Ionel Halaciuga

Jay Scott Schickling

George Lee Peabody, V

Sylas LaPlante

Kai Zhong

Roberto Irizarry-Rivera

Rob Cockerill

Victor M Rivera Alvarado

Warren Harrell

Tammy C Pluym

Shirley W Lyons

Michele L Ostraat

Roberto Irizarry-rivera

Jr Russell Bertrum Diemer

John Cocker

This disclosure relates to a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying a fine silver particle dispersion on a substrate, wherein the fine silver particle dispersion comprises, (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300&#xb0; C., wherein the weight percentages are based on the weight of the fine silver particle dispersion; and (b) heating the applied fine silver particle dispersion at 80 to 1000&#xb0; C.

Fine silver particle dispersion

This disclosure relates to a fine silver particle dispersion comprising: (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300&#xb0; C., wherein the weight percentages are based on the weight of the fine silver particle dispersion.

This disclosure relates to a fine silver particle dispersion including: (1) 65 to 95.4% by weight of fine silver particles which have an average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having a primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, and (3) 0.1 to 1.0% by weight of ethyl cellulose having a weight average molecular weight of 10,000 to 120,000.

This disclosure relates to a conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprising: (1) 65 to 95.4% by weight of fine silver particles which have average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, (3) 0.1 to 1.0% by weight of ethyl cellulose having weight average molecular weight of 10,000 to 120,000. Also provided are: a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying said fine silver particle dispersion on a substrate, and (b) heating the applied fine silver particle dispersion at 80 to 1000&#xb0; C.; and an electrical device comprising a conductive thick film made with the foregoing paste.

A thick film paste comprising at least one particulate platinum (alloy), at least one metal compound, and an organic vehicle, wherein the at least one metal compound is selected from the group consisting of in each case particulate NiO, SiO, RuO, RhO, IrO, CuO, CuO, TiO, ZrO, PbO, SnO, CeO, AlO, MgO, MnOand MoO, and metal compounds capable of forming a metal oxide on firing, the metal oxide being selected from the group consisting of NiO, SiO, RuO, RhO, IrO, CuO, CuO, TiO, ZrO, PbO, SnO, CeO, AlO, MgO, MnOand MoO.

Thick film paste and use thereof

The invention is directed to systems and methods for making non-hollow, non-fragmented spherical metal or metal alloy particles using diffusion dryers.

Method of making non-hollow, non-fragmented spherical metal or metal alloy particles

Disclosed are methods of making multi-element, finely divided, metal powders containing one or more reactive metals and one or more non-reactive metals. Reactive metals include metals or mixtures thereof from titanium (Ti), zirconium (Zr), hafnium (Hf), tantalum (Ta), niobium (Nb), vanadium (V), nickel (Ni), cobalt (Co), molybdenum (Mo), manganese (Mn), and iron (Fe). Non-reactive metals include metals or mixtures such as silver (Ag), tin (Sn), bismuth (Bi), lead (Pb), antimony (Sb), zinc (Zn), germanium (Ge), phosphorus (P), gold (Au), cadmium (Cd), berrylium (Be), tellurium (Te).

Multi-element metal powders for silicon solar cells

The invention relates to a corrosion resistant reactor tube, method for providing a passivating or corrosion resistant coating to the inside of the reactor tube, and a method of making high bismuth glass powders using the corrosion resistant reactor tube.

Method for making glass frit powders using aerosol decomposition

Photovoltaic cells, including silicon solar cells, and methods and compositions for making such photovoltaic cells are provided. A silicon substrate having p-type silicon base and an n-type silicon layer is provided with a silicon nitride layer, an exchange metal in contact with the silicon nitride layer, and a non-exchange metal in contact with the exchange metal. This assembly is fired to form a metal silicide contact on the silicon substrate, and a conductive metal electrode in contact with the metal silicide contact. The exchange metal is from nickel, cobalt, iron, manganese, molybdenum, and combinations thereof, and the non-exchange metal is from silver, copper, tin, bismuth, lead, antimony, arsenic, indium, zinc, germanium, gold, cadmium, beryllium, and combinations thereof.

Compositions and processes for forming photovoltaic devices

Disclosed is a plurality of glass-crystalline particles, wherein at least a portion of the glass-crystalline particles comprise a glass component and a crystalline component, and wherein the crystalline component comprises one or more metal oxides wherein the metal is selected from the group consisting of: Zn, Ca, Sr, Mg, Ba, and mixtures thereof.

Glass-crystalline particle powders including a glass component and a crystalline component

Disclosed is a process for the manufacture of glass-crystalline particles comprising a glass component and a crystalline component comprising the steps of:

Methods of making glass-crystalline particles including a glass component and a crystalline component

The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.

Donor elements and processes for thermal transfer of nanoparticle layers

Dispersed, crystalline, stable to oxidation copper particles are prepared in the absence of polymeric dispersants by rapidly reducing a Cu(I) salt with an Fe(II) carboxylic acid complex in water. The resulting microns sized copper powders contain only organics which decompose at temperatures low enough not to interfere with sintering processes and the formation of conductive copper structures.

Method for producing dispersed, crystalline, stable to oxidation copper particles

Disclosed is an improved process for making highly dispersible, spherical silver particles. In particular, the invention is directed to a process for making silver particles, which are very high solids and highly ordered. The silver particles formed are particularly useful in electronic applications.

Process for making highly dispersible spherical silver powder particles and silver particles formed therefrom

Growing community of inventors

Durham, NC, United States of America

Howard David Glicksman