Input/output, Inc.

Massachusetts Institute of Technology

Ion Geophysical Corporation

Howard D Goldberg

Duli Yu

Martin Arnold Schmidt

Arjun Selvakumar

Lianzhong Yu

James L Marsh

Matthew W Ip

Philip Simon

Bing-Fai Fung

Robert P Ried

W Marc Stalnaker

Peter Maxwell

Lawrence Philip Behn

Axel Michael Sigmar

Thomas M Buie

Guido Lemke

Ray Rinne

Demetrios Balderes

Klaus Domagalski

David Morgan

Kees Faber

Sjoerd Altman

Richard Laroo

Larry Rushefsky

Taechung Yi

An accelerometer () for measuring seismic data. The accelerometer () includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer () also includes a top cap press frame recess () and a bottom cap press frame recess () for isolating bonding pressures to specified regions of the accelerometer (). The accelerometer () is vacuum-sealed and includes a balanced metal pattern () to prevent degradation of the performance of the accelerometer (). A dicing process is performed on the accelerometer () to isolate the electrical leads of the accelerometer (). The accelerometer () further includes overshock protection bumpers () and patterned metal electrodes to reduce stiction during the operation of the accelerometer ().

Sensor design and process

The present invention provides a digital optical switch apparatus and process for manufacturing the apparatus. The apparatus includes a mirror assembly coupled to a top cap and to a bottom cap. The top and bottom caps each include one or more electrodes that, when energized with electrical energy, move a mirrored surface to one of a plurality of discrete positions. Mirror assemblies can be cascaded to create a packaged assembly having any multiple of discrete positions. The process includes planar micro-machining techniques to create isolated islands for electrical feed through. The process enables mechanical bonding of multiple tiers via a single bond region and through a bond-pad window.

Digital optical switch apparatus and process for manufacturing same

A sensor apparatus () includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module () supported by a planar surface () within a cavity () of a housing () coupled to a first end cap () by a PC-board connection (). Housing () is further coupled to first end cap () by a first coupling member () and a second coupling member () and is also coupled to an opposite second end cap () by a third coupling member () and a fourth coupling member (). Interface sealing members () seal between housing () and first end cap (). Interface sealing members () seal between housing () and second end cap ().

Integrated and multi-axis sensor assembly and packaging

A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.

Low stress die attachment

A merged-mask micro-machining process is provided that includes the application of a plurality of layers of masking material that are patterned to provide a plurality of etching masks.

Merged-mask micro-machining process

A micro machined structure includes one or more temporary bridges for temporarily coupling the micro machined structure to a support structure.

Temporary bridge for micro machined structures

A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges. At least two electrostatic force application pads are disposed to rotate the mirror about a primary axis and about a secondary axis.

Dual axis micro machined mirror device

A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges and includes travel stops that limit motion of the mirror in the z-direction. The top and bottom micro machined caps also include travel stops that limit motion of the mirror in the z-direction.

Micro machined mirror

A sensor microstructure contact scheme is provided for making backside electrical, mechanical, fluidic, or other contact to mechanical microstructures. The contact scheme is applicable to pressure sensors, shear stress sensors, flow rate sensors, temperature sensors, resonant microactuators, and other microsensors and microactuators. The contact scheme provides a microelectromechanical sensor body and support structure for backside contact of the sensor body, and features a support wafer substrate having one or more through-wafer vias each with a lateral span on the dimension of microns and a span that is more narrow at the wafer front surface than at the wafer back surface. An insulating film covers a portion of the support wafer substrate and sidewalls of the vias--with the lateral via span at the front surface being open. The front surface of the support wafer substrate is bonded to the front surface of a sensor body wafer substrate, such that contact of the front surface of the sensor body wafer substrate may be made through the support wafer substrate vias from the back surface of the support wafer substrate. The sensor body wafer substrate is adapted to define a mechanical sensor microstructure, and comprises a plurality of isolated substrate regions, each region corresponding to one of the support wafer substrate through-wafer vias. Each such region is circumscribed by an edge of the mechanical sensor microstructure and an isolating border region. Contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions is isolated and thereby prevented from making contact to any other sensor body substrate region.

Backside contact of sensor microstructures

Growing community of inventors

Sugar Land, TX, United States of America

Howard D Goldberg