Powerchip Semiconductor Corporation

Houng-Chi Wei

Saysamone Pittikoun

Wei-Chung Tseng

Chien-Lung Chu

Hsin-Heng Wang

Shih-Hsiang Lin

Shi-Hsien Chen

A junction-free NAND flash memory is described, including a substrate, memory cells, source/drain inducing (SDI) gates electrically connected with each other, and a dielectric material layer. The memory cells are disposed on the substrate, wherein each memory cell includes a charge storage layer. Each SDI gate is disposed between two neighboring memory cells. The dielectric material layer is disposed between the memory cells and the SDI gates and between the SDI gates and the substrate.

Junction-free NAND flash memory and fabricating method thereof

A method of fabricating non-volatile memory is provided. A plurality of first memory cells is formed on the memory cell region of a substrate. Each first memory cell comprises a first composite layer, a first gate and a cap layer. There is a gap between two adjacent first memory cells. Then, a plurality of gates is formed in the respective gaps. The gates together with a second composite layer form a plurality of second memory cells. The second memory cells and the first memory cells together constitute a memory cell column. In the meantime, a plurality of gate structures is also formed on the peripheral circuit region. The gates in the gaps and the gates in the peripheral circuit region are fabricated using different conductive layers.

Method of fabricating non-volatile memory

A method of fabricating a non-volatile memory is provided. A memory cell array having first memory units and second memory units is formed on a substrate. Then, a source region and a drain region are formed in the substrate on the respective sides of the memory cell array. Next, a patterned first inter-layer insulating layer is formed on the substrate to form a first trench and a plurality of second trenches. A conductive layer is formed on the substrate to form a source line in the first trench and conductive lines in the second trenches. A second inter-layer insulating layer is formed on the substrate and then a conductive plug having contact with the drain region is formed in the second inter-layer insulating layer and the first inter-layer insulating layer. Then, a bit line having contact with the conductive plug is formed on the second inter-layer insulating layer.

Non-volatile memory device

A method of fabricating non-volatile memory is provided. A plurality of first memory cells is formed on the memory cell region of a substrate. Each first memory cell includes a first composite layer, a first gate and a cap layer. There is a gap between two adjacent first memory cells. Then, a plurality of gates is formed in the respective gaps. The gates together with a second composite layer form a plurality of second memory cells. The second memory cells and the first memory cells together constitute a memory cell column. In the meantime, a plurality of gate structures is also formed on the peripheral circuit region. The gates in the gaps and the gates in the peripheral circuit region are formed using the same conductive layers.

A method of fabricating a non-volatile memory is described. A plurality of first memory units having gaps between each other is formed over a substrate. Insulating spacers are formed on the sidewalls of the first memory units. A composite layer is formed on the substrate and the gaps between the first memory units are filled with a doped polysilicon layer. Thereafter, a portion of the doped polysilicon layer is removed to form trenches. After that, a metallic layer fills the trenches. A portion of the metallic layer is removed to form a plurality of gates. The gates and the composite layer together form a plurality of second memory units. The second memory units and the first memory units together constitute a memory cell column. Then, a source region and a drain region are formed in the substrate adjacent to the two sides of the memory cell column.

A method for manufacturing semiconductor device is provided. First, a substrate is provided. Then, a plurality of first gate lines disposed in parallel to each other and a first dummy gate line disposed in a direction perpendicular to the first gate lines are formed on the substrate. There is a first gap between the first dummy gate line and the first gate lines and there is a second gap between every pair of adjacent first gate lines. Thereafter, a second composite layer and a conductive layer are sequentially formed over the substrate. The conductive layer is etched back to form a plurality of second device structures that completely fills the second gaps. Then, the conductive layer in the first gap is removed.

Method for manufacturing semiconductor device and non-volatile memory

A method of fabricating a non-volatile memory includes providing a substrate having a composite dielectric layer, a sacrificial layer and a mask layer sequentially formed thereon. The mask layer is patterned to form a plurality of first openings for exposing a portion of the sacrificial layer. The sacrificial layer exposed by the first openings is removed and a plurality of first gates is formed in the first openings. The mask layer is further removed to form a plurality of second openings between the first gates. An insulating layer is formed on the tops and sidewalls of the first gates. A portion of the sacrificial layer exposed by the second openings is removed and a plurality of second gates is formed in the second openings. The second gates and the first gates embody a memory cell column. Source/region regions are formed in the substrate beside the memory cell column.

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Hsinchu, Taiwan

Houng-Chi Wei