Lite-On Technology Corporation

Silitek Electronic (Guangzhou) Co., Ltd.

Lite-On Opto Technology (Changzhou) Co., Ltd.

Lite-On Electronics (Guangzhou) Limited

Hou-Te Lee

Tsung-Kang Ying

Chia-Hung Chu

Shih-Po Yu

Chia-Ming Tu

Erh-Chan Hsu

The instant disclosure provides a light-emitting module and a method of manufacturing a single light-emitting structure. The light-emitting module includes two identical light-emitting structures disposed on the same plane. One of the two light-emitting structures disposed on the plane is rotated by 180 degrees relative to the other light-emitting structure, and the two light-emitting structures are connected to each other. Each light-emitting structure includes a base, a conducting element, a light-emitting element and an encapsulation element. The conducting element includes a plurality of conductors separated from each other and passing through the base body, where the number of the conductors is N and N&#x3e;1. The light-emitting element includes at least one light-emitting chip electrically connected between at least two of the conductors. The encapsulation element includes a transparent encapsulation body disposed on the base to cover the conducting element and the light-emitting element.

Method of manufacturing a single light-emitting structure

Light emitting diode

Light-emitting module and method of manufacturing a single light-emitting structure thereof

An LED package structure includes: an insulating substrate that has a front bonding pad assembly; a dark-colored die-attach adhesive; blue and green LED chips mounted on the front bonding pad assembly via the dark-colored die-attach adhesive; and a dark-colored and light-transmissible encapsulant that is disposed on the insulating substrate and that encapsulates the blue and green LED chips. The encapsulant has a light transmittance that ranges from 7% to 28% for the blue light and has a light transmittance that ranges from 9% to 30% for the green light.

LED package structure including dark-colored and light-transmissible encapsulant

An LED substrate structure has a substrate and a conducting portion. The substrate has a bottom surface and two opposite first lateral surfaces connected with the bottom surface. The bottom surface has the conducting portion formed thereon, and the conducting portion has a first cutting segment located on a contact border defined between one of the two first lateral surfaces and the bottom surface. The conducting portion further has an expansion region connected with the first cutting segment. The length of the first cutting segment is shorter than any segment taken on the expansion region parallel thereto.

LED substrate structure, LED unit and lighting module having the same

LED device

Growing community of inventors

Kaohsiung, Taiwan

Hou-Te Lee