Dell Products Inc.

Hou-Chun Wang

Craig Lawrence Chaiken

Yaotsung Chang

Hong-Ling Chen

Kuo-Chieh Lai

Tsan-Wei Liu

Tsanwei Liu

An assembly, comprising a junction connector, including: a circuit board connector positioned on a first side of the junction connector; a plurality of spring loaded pins positioned on a second side of the junction connector, the second side opposite to the first side, wherein the circuit board connector is connected to the plurality of spring loaded pins; a dongle, including: an external port positioned on a first side of the dongle; and a connector pad positioned on a second side of the dongle, wherein the external port is connected to the connector pad, wherein the dongle is coupled to the junction connector such that the connector pad of the dongle is connected to the plurality of spring loaded pins of the junction connector, wherein the circuit board connector of the junction connector is configured to be coupled with a socket of an information handling system.

Junction connector for modular dongle assembly

An information handling system may include a strain force fuse formed on a circuit board of the information handling system, the strain force fuse configured to experience an impedance discontinuity in response to a mechanical force applied to the circuit board at or proximate to the strain force fuse and a management controller electrically coupled to the strain force fuse and configured to provide out-of-band management facilities for management of the information handling system, the management controller further configured to detect whether the impedance discontinuity has occurred.

Systems and methods for detecting mechanical strain on a circuit board

An information handling system may include a circuit board, an integrated circuit package mounted on the circuit board, the integrated circuit package comprising: a plurality of solder balls for electrically coupling the integrated circuit package to the circuit board, the plurality of solder balls comprising a first solder ball and a second solder ball, an internal electrical coupling coupled between the first solder ball and the second solder ball, and a management controller electrically coupled to the internal electrical coupling, the first solder ball, and the second solder ball, and configured to provide out-of-band management facilities for management of the information handling system, the management controller further configured to detect whether an impedance discontinuity has occurred with respect to one or both of the first solder ball and the second solder ball.

Systems and methods for detecting mechanical strain on a ball of a ball grid array

An information handling system includes a palm rest portion of a keyboard cover, a touchpad holder, and a spring plate. The spring plate includes a main frame in physical communication with the palm rest portion, and first and second spring arms in physical communication with the touchpad holder. In response to a force being exerted on any area of the touchpad holder, the first and second spring arms transition from a resting position to a clicked position.

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Linkou Dist., Taiwan

Hou-Chun Wang