Samsung Electronics Co., Ltd.

Hosik Jun

Sangbok Yun

Seungjin Yoon

Jaehyuk Lim

Hyojeong Kang

Yonggi Cho

A light-emitting diode (LED) package includes a substrate including an insulating material; upper pads on an upper surface of the substrate; a side surface molding layer covering the upper surface of the substrate and side surfaces of the upper pads; an LED chip on the upper surface of the substrate and electrically connected to the upper pads; a fluorescent layer on the LED chip; and a reflection molding layer on the substrate and covering the LED chip, the reflection molding layer including white silicon, wherein the reflection molding layer exposes a portion of side surfaces of the fluorescent layer.

Light emitting diode (LED) package having reflection molding layer covering led chip

A light emitting diode (LED) package is provided. The LED package includes a package body having a concave portion; an LED chip disposed on the concave portion; a phosphor sheet disposed on the LED chip; a barrier wall disposed on the concave portion and spaced apart from the LED chip by a first distance, the barrier wall being disposed in parallel with at least one side surface of the LED chip, an upper surface of the barrier wall being higher than an upper surface of the LED chip with respect to the lower surface of the concave portion and disposed at a level that is 50 &#x3bc;m or less from an upper surface of the phosphor sheet; and an encapsulation portion disposed on the LED chip, a side surface of the phosphor sheet and a side surface of the barrier wall.

Growing community of inventors

Hwaseong-si, South Korea

Hosik Jun