Jfe Precision Corporation

Jfe Steel Corporation

National Institute of Advanced Industrial Science and Technology

Tokin Corporation

Sunstar Engineering Pte. Ltd.

Hoshiaki Terao

Raita Wada

Kouichi Hashimoto

Satoshi Uenosono

Hideaki Kobiki

Hiroki Ota

Naomichi Nakamura

Mineo Muraki

Takuya Takashita

Kimihiro Ozaki

Akiri Urata

Makoto Nakaseko

Yoshinori Shinagawa

Toshinori Tsuda

Makoto Yamaki

Tsuyoshi Nakatsuji

Hidoaki Kobiki

Yu Kanamori

Koichi Okamoto

Shoichi Sato

Satoshi Intellectual Property Dept Uenosono

Hideaki Intellectual Property Dept Kobiki

Provided is a heat sink having a clad structure of Co—Mo composite materials and Cu materials, satisfying high heat-sink properties required of the heat sink for use in a semiconductor package with a frame on which a high-output and small-sized semiconductor is mounted, and preventing, when applied to the semiconductor package with a frame, crack of the frame due to local stress concentration. The heat sink has three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that the Cu layers are outermost layers on both sides thereof, the Cu layers as the outermost layers each having a thickness tof 40 μm or more, the heat sink satisfying 0.06≤t/T≤0.27 (where T: heat sink thickness) and t/T≤0.36/[(total number of layers−1)/2] (where t: Cu—Mo composite layer thickness, the total number of layers: sum of numbers of Cu layers and Cu—Mo composite layers).

Heat sink, semiconductor package and semiconductor module

Provided is a method of manufacturing a soft magnetic dust core. The method includes: preparing coated powder including amorphous powder made of an Fe-B-Si-P-C-Cu-based alloy, an Fe-B-P-C-Cu-based alloy, an Fe-B-Si-P-Cu-based alloy, or an Fe-B-P-Cu-based alloy, with a first initial crystallization temperature Tand a second initial crystallization temperature T; and a coating formed on a surface of particles of the amorphous powder; applying a compacting pressure to the coated powder or a mixture of the coated powder and the amorphous powder at a temperature equal to or lower than T−100 K; and heating to a maximum end-point temperature equal to or higher than T−50 K and lower than Twith the compacting pressure being applied.

Method of manufacturing soft magnetic dust core

Provided is a heat sink that has a clad structure of a Cu&#x2014;Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. A heat sink comprises three or more Cu layers and two or more Cu&#x2014;Mo composite layers alternately stacked in a thickness direction so that two of the Cu layers are outermost layers on both sides, wherein each of the Cu&#x2014;Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. The heat sink has a low coefficient of thermal expansion and also has high thermal conductivity in the thickness direction because the thickness of each of the Cu layers which are the outermost layers is reduced, as compared with a heat sink of a three-layer clad structure having the same thickness and density.

Heat sink and method for manufacturing same

A sintered friction material for brake having a high friction coefficient, with which reduction of the friction coefficient is prevented at high temperature and stable brake performance is maintained. It comprises: a metal matrix of Ni or Ni+Fe (small amount); a solid lubricant (a); and a friction adjusting material (b) including: metal or alloy particles (b1) having an average particle size of 50 &#x3bc;m or more and containing at least one selected from W, Mo, Cr, and FeW; and inorganic particles (b2) containing at least one selected from oxides, nitrides, carbides, and intermetallic compounds. An average particle size dof b1 and an average particle size dof b2 satisfy d&#x3c;d. Dispersing, in the metal matrix, b1 and b2 satisfying particular conditions as the friction adjusting material can produce a geometrical structure (particle structure with a high filling density) suitable for preventing plastic deformation of the sintered friction material.

Sintered friction material for brake

Provided is a heat sink that has a clad structure of a Cu&#x2014;Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. The heat sink comprises a pair of Cu&#x2014;Mo composite layers and a Cu layer stacked in a thickness direction so that the Cu layer is interposed between the Cu&#x2014;Mo composite layers or comprises three or more Cu&#x2014;Mo composite layers and two or more Cu layers alternately stacked in the thickness direction so that two of the Cu&#x2014;Mo composite layers are outermost layers on both sides, wherein each of the Cu&#x2014;Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. Such a clad structure achieves high thermal conductivity together with a low coefficient of thermal expansion.

A heat sink for an electronic device includes a Cr&#x2014;Cu alloy layer including a Cu matrix and more than 30 mass % and not more than 80 mass % of Cr; and Cu layers provided on top and rear surfaces of the Cr&#x2014;Cu alloy layer.

Heat sink for electronic device and process for production thereof

In a Cr&#x2014;Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr&#x2014;Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr&#x2014;Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processibility. A method for producing the Cr&#x2014;Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr&#x2014;Cu alloy, are also provided.

Cr-Cu alloy, method for producing the same, heat-release plate for semiconductor, and heat-release component for semiconductor

It is an object to provide an inexpensive alloy for heat dissipation having a small thermal expansion coefficient as known composite materials, a large thermal conductivity as pure copper, and excellent machinability and a method for manufacturing the alloy. In particular, since various shapes are required of the alloy for heat dissipation, a manufacturing method by using a powder metallurgy method capable of supplying alloys for heat dissipation, the manufacturing costs of which are low and which take on various shapes, is provided besides the known melting method. The alloy according to the present invention is a Cu&#x2014;Cr alloy, which is composed of 0.3 percent by mass or more, and 80 percent by mass or less of Cr and the remainder of Cu and incidental impurities and which has a structure in which particulate Cr phases having a major axis of 100 nm or less and an aspect ratio of less than 10 are precipitated at a density of 20 particles/&#x3bc;min a Cu matrix except Cr phases of more than 100 nm.

Alloy for heat dissipation of semiconductor device and semiconductor module, and method of manufacturing alloy

Growing community of inventors

Niigata, Japan

Hoshiaki Terao