Te Connectivity Sensors Germany Gmbh

Te Conectivity Smart Grid Gmbh

Horst Sirtl

Heinrich Zitzmann

Dirk Nusse

Stefan Andreas Roessinger

A sensor assembly for a resistance temperature sensor element includes a substrate and a measuring structure disposed on the substrate. The substrate includes a first material and a stabilized second material. The first material is at least one of aluminum oxide, spinel (magnesium aluminate) and yttrium-aluminum-garnet. The stabilized second material is at least one of stabilized zirconium dioxide and stabilized hafnium dioxide. The stabilized second material is stabilized by containing an oxide of an element having a valence different from four. A coefficient of thermal expansion of the substrate deviates by less than 5% from a coefficient of thermal expansion of the measuring structure.

Sensor assembly for a resistance temperature sensor element and resistance temperature sensor element

A substrate for a sensor assembly of a resistance thermometer is disclosed. The substrate is comprised of aluminum oxide and zirconium dioxide and has a thermal coefficient of expansion approximately equal to the terminal coefficient of expansion of platinum.

Substrate for a sensor assembly for a resistance thermometer, sensor assembly, resistance thermometer and method of producing such a substrate

A substrate for a sensor assembly of a resistance thermometer is disclosed. The substrate is comprised of spinel and magnesium oxide and has a thermal coefficient of expansion approximately equal to the thermal coefficient of expansion of platinum.

A substrate for a sensor assembly of a resistance thermometer is disclosed. The substrate has a plurality of first layers formed of a first material and a plurality of second layers formed of a second material. The first and second layers are disposed over one another such that a thermal coefficient of expansion of the substrate is approximately equal to the thermal coefficient of expansion of platinum.

A sensor assembly for a resistance thermometer is disclosed. The sensor assembly comprises a substrate, a measuring structure disposed on the substrate, and a cover layer disposed on the measuring structure. The cover layer has a plurality of first layers formed of a first material and a plurality of second layers formed of a second material. The first and second layers are disposed over one another such that a thermal coefficient of expansion of the cover layer is adapted to a thermal coefficient of expansion of the measuring structure.

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Lauf a.d. Pegnitz, Germany

Horst Sirtl