Alcatel N.v.

Bayer Aktiengesellschaft

Horst Richter

Matjaz Florjancic

Stauros Smernos

Otto Thaidigsmann

Bruno Hees

Gerhard Seibold

Johann Springer

Karin Ruess

Hans Hoffmann

Hans Reiner

Walter Jorg

The invention concerns a method of forming a number of electric conductors at a very short distance from the end of depressions such as V-grooves on a substrate. In one configuration example, a film of PTFE or of a similar material is laminated over the entire surface of the substrate. Holes are etched in the film. The holes are metallized. Conductive paths are formed, which are electrically connected to the metallized holes. The film in the area of the grooves is removed by etching. In another configuration example, the grooves are temporarily filled with a photoresist and the conductive paths and contact surfaces are formed in accordance with a photolithographic method.

Method of forming conductive paths on a substrate containing depressions

A circuit board with a cooling device having channels through which a cooling agent flows, the circuit board being comprised of at least three united layers including an inner layer wherein the channels are formed.

Circuit board with cooling device

Coaxial signal lines of rectangular cross-section are fabricated for use in integrated high- and ultra-high-frequency circuits, thereby eliminating crosstalk. A photolithographic film not only assists in the formations of metallic conductive areas, but also remains between those conductive areas as the dielectric material between inner and outer conductors of a fully shielded rectangular coaxial cable. The coaxial cable is formed in a process which comprises various photoprocessing, electrodeposition, chemical deposition and chemical etching steps, but which avoids mechanical surfacing to remove insulating material from adjacent portions of the conductive walls of the outer conductor of the coaxial cable.

Method for fabricating a fully shielded signal line

An article of manufacture useful as the base for an electronic circuit board is a substrate with an enamel layer having a heterogeneous structure containing at least two different phases obtained by applying a homogeneous, alkali-containing enamel powder to the substrate followed by heating at 850.degree. C. to 1,000.degree. C. wherein the enamel power has the composition as follows:

Enamellings with heterogeneous structure

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Boblingen, Germany

Horst Richter