Continental Automotive Gmbh

Mannesmann Kienzle Gmbh

Vdo Kienzle Gmbh

Mannesmann Kienlze Gmbh

Horst Plankenhorn

Bernd Meyer

Willibald Reitmeier

Denny Schädlich

Erwin Hess

Thomas Grill

Detlef Böhler

Thomas Lindner

Wolfgang Schreiber-Prillwitz

Andrea Busse

A sensor apparatus includes a housing with a security device, a secure first computation device, a second computation device and a sensor element. The sensor apparatus detects a temperature in the housing, to activate the first computation device only when the detected temperature is in a predefined temperature range, to determine a session key by the first computation device and to store the session key in a second memory of the second computation device, to deactivate the first computation device after the session key has been stored, to determine data on the basis of a sensor signal detected using the sensor element and to encrypt and/or sign the data by the second computation device on the basis of the session key.

Method for operating a sensor apparatus and sensor apparatus

In a data transmission method for a tachograph system, digital messages are transmitted between a speed transmitter (MS) and a recording unit (RU). The digital messages contain a pair of keys including a public key (KMP, KRP) and a private key (KMS, KRS), as well as a certificate (ZM, ZR) derived from the respective pair of keys. The public keys (KMP, KRP) and the certificates (ZM, ZR) are mutually verified between the recording unit (RU) and the speed transmitter (MS). If the verification is positive, the speed transmitter (MS) detects sensor data, and a digital message is generated therefrom. In addition, the speed transmitter (MS) generates authentication data for the message in accordance with the pair of keys (KMP, KMS) thereof. The message and the authentication data are transmitted to the recording unit and are processed there in accordance with a validity of the authentication data verified by the recording unit (RU).

Data transmission method, and tachograph system

A method and an apparatus are proposed in order to bond multilayered substrate packages over a large surface at uniform heating in the course of one single work step, wherein the structured substrates are to begin with aligned to one another with high precision to correspond to the structuring in a working area separate from the heating apparatus.

Method and device for stacking substrates which are to be joined by bonding

A method for sealing apertures caused by manufacturing processes in micromechanical acceleration sensors is disclosed whereby apertures or recesses, serving for leading the conductor paths out of the oscillation space of an acceleration sensor without causing short circuits, can be sealed in a gas-tight manner in a simple way. The conductor paths establish the conducting connection between junction contacts of the acceleration sensor accessible from the outside with electrodes which are allocated on both sides to the oscillating mass of the acceleration sensor which is also configured as an electrode. The method provides to use an adhesive, which is curable or hardenable by means of light, and in particular, ultraviolet light. A specific quantity of the adhesive is applied at a certain point of the acceleration sensor and, after an experimentally determined distribution time period has elapsed, after which the adhesive has also penetrated into the recesses under the influence of capillary effect and has sealed same, is hardened or cured by exposure to light. The sealing process occurs in a nitrogen atmosphere. Prior to the above, the oscillation space was evacuated.

Process for sealing apertures in glass-silicon-glass micromechanical

A process for separating a glass-silicon-glass layer package wherein the glass-silicon-glass layer package is produced at a minimum process cost and is constructed from a plurality of acceleration sensors constructed with micro-mechanical structure techniques. At the same time, dirt is to be prevented from entering the acceleration sensors and the connection contacts are to be freed automatically. Separation is effected substantially by crosswise cutting and subsequent breaking. In order to prevent an 'opening' of the acceleration sensors when cutting in one direction, i.e. transversely relative to the flexural resonators, and to achieve a defined breaking, one glass disk is cut until a predetermined breaking point is reached and the other glass disk is severed in a parallel plane. An intermediate layer which surrounds the connection in a U-shaped manner, serves as a blocking layer arranged between the two dividing planes and impedes a bonding of the glass disk and the silicon disk.

Growing community of inventors

Villingen-Schwenningen, Germany

Horst Plankenhorn