E.i. Dupont De Nemours and Company

Horst Lehmann

Klausjoerg Klein

Rudolf Schipfer

Hans-Peter Bünger

Waterborne cathodic electrodeposition (CED) coating agents comprising resin solids and optionally pigments, fillers, organic solvents and conventional coating additives, wherein said CED coating agents comprise at least one bismuth salt selected from the group consisting of bismuth hydroxycarboxylic acid salts and bismuth sulfonic acid salts in a quantity of 0.1 to 2.5 wt-%, calculated as bismuth and relative to resin solids content, together with at least one compound selected from the group consisting of yttrium and neodymium compounds in a quantity of 0.1 to 1 wt-%, calculated as metal and relative to resin solids content.

Cathodic electrodeposition coating agents containing bismuth salts together with yttrium and/or neodymium compounds, production and use thereof

Waterborne cathodic electrodeposition (CED) coating compositions comprising resin solids and optionally pigments, fillers and conventional coating additives, wherein said CED coating compositions comprise at least one bismuth compound in a quantity of 0.1 to 2.5 wt. %, calculated as bismuth and relative to resin solids content, together with at least one dicarboxylic acid selected from among acyclic dicarboxylic acids with 3 to 7 carbon atoms and dicarboxylic acids with 8 to 10 carbon atoms comprising a cyclic structural unit in a quantity of 3 to 15 equivalent-%, relative to the acid equivalents present in the CED coating composition.

Cathodic electrodeposition coating compositions containing bismuth compounds and dicarboxylic acids, production and use thereof

A process for the production of a CED (cathodic electrodeposition) coating with improved adhesion towards subsequent layers by cathodic electrodeposition of a coating layer of a CED coating composition onto an electrically conductive substrate and thermal curing by baking in an indirectly heated circulating air oven operated with a proportion of fresh air in the circulating air of the oven of 0 to 20 vol. %, wherein the CED coating composition used contains at least one water-soluble metal nitrate corresponding to a quantity of 1 to 10 mmol of nitrate per 100 g of resin solids content, wherein the metal is selected from the group consisting of metals of atomic numbers 20 to 83, with the exception of chromium, arsenic, rubidium, ruthenium, rhodium, palladium, cadmium, antimony, caesium, osmium, iridium, platinum, mercury, thallium and lead, and wherein at most 50 area-% of the CED-coated substrate surface are rinsed with water prior to thermal curing.

Process for producing coatings on electrically conductive substrates by cathodic electrodeposition coating

Aqueous cleaning agent and its use in a process for cleaning ultrafiltration membranes in ultrafiltration units of electro-dipcoating plants, which cleaning agent contains electro-dipcoating lacquer (EDL) binders overneutalized with neutralizing agent.

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Wuppertal, Germany

Horst Lehmann