W.c. Heraeus Gmbh

Koninklijke Philips Corporation N.v.

Horst Hartmann

Alfred Bauer

Friedrich Lach

Gunter Herklotz

Thomas Loose

Karl-Heinz Ullrich

Veronika Sauer

G&uuml;nter Kolodzei

Ben Slager

The chips for chip cards are customarily provided on a film strip which consists of a synthetic foil and a conductor track pattern and are connected to the conductor track pattern by way of bonding wires. Automatic mounting is made possible by the use of a film strip with periodically arranged conductor track patterns. For chips which can be driven via contacts as well as in a contactless manner, using a coil, conductor tracks are effectively provided on both sides of the synthetic foil forming the film strip. However, the film strip then becomes very inflexible so that it cannot be suitably handled by conventional automatic apparatus. The invention proposes to provide the metal foils wherefrom the conductor tracks are cut out with additional interruptions which reduce the cross-section of the metal foils at short intervals in the direction perpendicular to the longitudinal direction of the film. The film strip thus becomes more flexible so that it can be handled by conventional automatic apparatus.

Film used as a substrate for integrated circuits

A process and apparatus for producing a laminate containing a metal foil strip and a plastic film strip, in which the two strips have stamped structures repeated at regular intervals in the longitudinal direction of the strips and are disposed at contiguous points in the laminate, a pre-stamped strip and the second strip being continuously joined together from one end. To laminate stamped plastic film tape together with a pre-stamped metal foil tape, with the least possible complexity, so that any mismatch between the stamped structures of the two tapes is as small as possible, after the strips have been merged, the position of position markings for the stamped structures in the second strip and on the pre-stamped strip are successively scanned and, once a predetermined position of the position markings has been reached, a stamped structure is introduced into that region of the second strip situated in front of the site of the joining together, at a distance from the predetermined position corresponding to an integral multiple of the interval at which the stamped structures of the pre-stamped metal strip are repeated.

Apparatus for producing a laminated strip of a metal foil and a plastic

Process and apparatus for producing a laminated strip of a metal foil

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Hanau, Germany

Horst Hartmann