Qualcomm Incorporated

Horst Droescher

Changhan Hobie Yun

Christian Hoffmann

Sebastian Brunner

Stefan Leopold Hatzl

Manuel Hofer

A package comprising an acoustic device, a polymer frame coupled to the acoustic device, a plurality of frame interconnects located in the polymer frame, where the plurality of frame interconnects are coupled to the acoustic device, a polymer cap layer coupled to the acoustic device though the polymer frame, where the polymer cap layer is configured as a cap for the acoustic device, a plurality of cap interconnects located in the polymer cap layer, where the plurality of cap interconnects are coupled to the plurality of frame interconnects, and a cavity located between the acoustic device and the polymer cap layer. The acoustic device includes a substrate and an acoustic element coupled to the substrate.

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Frauental an der Laßnitz, Austria

Horst Droescher