Growing community of inventors

Niskayuna, NY, United States of America

Hoonseok Seo

Average Co-Inventor Count = 3.10

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 0

Hoonseok SeoTaeyong Bae (6 patents)Hoonseok SeoSaehan Park (5 patents)Hoonseok SeoByounghak Hong (4 patents)Hoonseok SeoGil Hwan Son (4 patents)Hoonseok SeoKang Ill Seo (2 patents)Hoonseok SeoJeonghyuk Yim (2 patents)Hoonseok SeoKi-Il Kim (2 patents)Hoonseok SeoEuibok Lee (2 patents)Hoonseok SeoKang-ill Seo (1 patent)Hoonseok SeoKang-Ill Seo (1 patent)Hoonseok SeoInchan Hwang (1 patent)Hoonseok SeoSeungchan Yun (1 patent)Hoonseok SeoGilhwan Son (1 patent)Hoonseok SeoKiil Kim (0 patent)Hoonseok SeoHoonseok Seo (12 patents)Taeyong BaeTaeyong Bae (6 patents)Saehan ParkSaehan Park (10 patents)Byounghak HongByounghak Hong (42 patents)Gil Hwan SonGil Hwan Son (6 patents)Kang Ill SeoKang Ill Seo (9 patents)Jeonghyuk YimJeonghyuk Yim (9 patents)Ki-Il KimKi-Il Kim (9 patents)Euibok LeeEuibok Lee (6 patents)Kang-ill SeoKang-ill Seo (25 patents)Kang-Ill SeoKang-Ill Seo (18 patents)Inchan HwangInchan Hwang (15 patents)Seungchan YunSeungchan Yun (10 patents)Gilhwan SonGilhwan Son (1 patent)Kiil KimKiil Kim (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Samsung Electronics Co., Ltd. (12 from 131,214 patents)


12 patents:

1. 12317582 - Integrated circuit devices including a metal resistor and methods of forming the same

2. 12243820 - Semiconductor device with fine metal lines for BEOL structure and method of manufacturing the same

3. 12230571 - Integrated circuit devices including a power rail and methods of forming the same

4. 12218054 - Method of forming an integrated circuit device having an etch-stop layer between metal wires

5. 12142564 - Backside power distribution network semiconductor package and method of manufacturing the same

6. 12125788 - Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same

7. 12014951 - Semi-damascene structure with dielectric hardmask layer

8. 11990409 - Semiconductor device with fine metal lines for BEOL structure and method of manufacturing the same

9. 11881455 - Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same

10. 11769728 - Backside power distribution network semiconductor package and method of manufacturing the same

11. 11488864 - Self-aligned supervia and metal direct etching process to manufacture self-aligned supervia

12. 11450608 - Integrated circuit devices including metal wires having etch stop layers on sidewalls thereof

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
12/6/2025
Loading…