Samsung Electronics Co., Ltd.

Hyundai Motor Company

Kia Corporation

Hyundai Transys Incorporated

Hyundai Dymos Inc.

Daedong Movel System Co., Ltd.

Hoon Bok Lee

Sang Do Park

Chan Ho Jung

Uk-Song Kang

Jin-ho Kim

Mu Young Kim

Deok Soo Lim

Seong-Jin Jang

Nam-seog Kim

Dong Woo Jeong

Byung-sik Moon

Dong-hyeon Jang

Yo Han Kim

Woo-Dong Lee

Byung-Hyun Lee

Da Eun Lee

Kug Hun Han

Dong Hoon Keum

Seok Nam Kang

Sung Hoon Kim

Sang Ho Kim

Dong Hyun Kim

Dong Hoon Lee

Sang Shin Lee

In Ho Lee

Tae Hoon Lee

Jun Hwan Lee

Ho-Cheol Lee

Sung Hoon Lee

Chang Jae Lee

Sang-Bo Lee

Ho Suk Jung

Chi-Sung Oh

Hyeok Seung Lee

Jun Young Yun

Wan Jae Lee

Sung Il Lee

Seung Young Lee

Bong Ku Kim

Sang Hark Lee

Soon Joon Jung

Jung Bin Lee

Sin Jeong Kang

Han Kyeol Cho

Dong Gi Kim

Byung Guk Lim

Young Il Na

Mun Seung Kang

Kwon Yong Choi

Yoo Kon Cho

Kyung Sam Kim

Yim Ju Kang

Jae Nam Yoo

Yimju Kang

Yoon Gu Kim

A seat-interlocking leg rest control system includes: a first actuator configured to move a seat for a vehicle, the seat including a seat cushion and a seatback, in a forward-backward direction or an upward-downward direction of the vehicle; a second actuator configured to rotate a leg rest, rotatably coupled to the front end portion of the seat cushion, in the upward-downward direction; and a controller connected to the first actuator and the second actuator to control operation of the second actuator such that the rotation angle of the leg rest is limited based on the position of the seat.

System and method for controlling a seat-interlocking leg rest

Disclosed is an autonomous vehicle control apparatus including a sensor that obtains sensing information associated with an entity around a vehicle, a camera that obtains an image of the entity, and one or more processor that determine whether the entity is estimated to reach the vehicle at least a predetermined time after a door of the vehicle opens, and control a position of the door.

Apparatus and method for controlling autonomous vehicle

A vehicle includes a first sensor for sensing a first image, a second sensor for sensing a second image, and a processor that generates identification information of an object based on the first image, matches the identification information with payment request information including information about fare payment of the object, generates location information of the object based on the second image, matches the identification information with the location information to generate boarding information of the object, and determines a free riding of the object based on the boarding information and payment approval information corresponding to the identification information.

Vehicle and system for preventing free riding

The present disclosure provides a seat cushion extension device for a fold-and-dive seat. The seat cushion extension device may include a pair of seat cushion side frames arranged at a predetermined interval, a seatback frame rotatably connected to the pair of seat cushion side frames and having a guide pin formed on an outer surface thereof, a seat cushion frame, a pair of links rotatably connected between the pair of seat cushion side frames and a front end of the seat cushion frame, and a pair of extension frames. Each of the pair of extension frames may have a front end connected to the seat cushion frame, and a rear end formed with a guide hole, into which a guide pin may be inserted. The seat cushion extension device may facilitate a forward extension of a seat cushion regardless of a position of a seatback of the fold-and-dive seat.

Seat cushion extension device of fold and dive seat

An apparatus for rotating a headrest of a vehicle seat includes a headrest that is rotated forward to support a seat occupant's head upon reclining of a seatback. A seat occupant's head is comfortably supported by the headrest and a comfortable relaxation posture is implemented.

Apparatus for rotating a headrest of a vehicle seat

The present disclosure provides a device for reclining a seatback for a vehicle, which may allow a separate actuator to be driven by a switching signal of a lever switch when a user operates the lever switch with only a small force such that a cable connected to a latch for locking or unlocking a recliner may be pulled in an unlock direction of the recliner, thereby implementing the reclining operation for adjusting an angle of the seatback in a semiautomatic manner.

Device for reclining seatback for vehicle

A seat for a vehicle includes support links enabling a rotating motion and a sliding motion between a seat frame and seat rails, the support links being mounted so that the seat may be rotated in the forward and rearward directions as in a seesaw motion about a shaft of the vehicle in a width direction of the vehicle, so as to easily implement a facing mode posture, in which passengers sit facing each other, a relaxed comfort posture, etc.

Seat for vehicle

A polyurethane filter foam is provided herein. The polyurethane filter foam may have improved permeability by having both a small cell and a large cell in a range for maximizing the opening property of the foam. In some instance, this is achieved by specifically configuring and foaming a composition of polyether polyol and methylene diphenyl diisocyanate (MDI) to manufacture the polyurethane foam. The polyurethane foam of the present invention can be manufactured without performing a reticulation process.

Polyurethane filter foam

A side bolster adjusting apparatus of a seat of a vehicle for guiding a developing direction of a side airbag may include a side airbag developing direction guide plates integrally fixed to a seatback frame to guide a developing direction of the side airbag, side bolster adjusting plates hinged to rear ends of the side airbag developing direction guide plates, an airbag disposed between the side airbag developing direction guide plates and the side bolster adjusting plates to expand and shrink and to adjust positions of the side bolster adjusting plates, and a pneumatic control unit controlling expansion and shrinkage of the airbag.

Apparatus of side bolster for guiding developing direction of side airbag

A three-dimensional (3D) semiconductor device may include a stack of chips, including a master chip and one or more slave chips. I/O connections of slave chips need not be connected to channels on a motherboard, and only electrode pads of a master chip may be connected to the channels. Only the master chip may provide a load to the channels. A through-substrate via (TSV) boundary may be set on a data input path, a data output path, an address/command path, and/or a clock path of a semiconductor device in which the same type of semiconductor chips are stacked.

3D semiconductor device

A provided memory device is compatible with a mono-rank or multi-ranks. A plurality of memory layers are stacked in the memory device. The memory device receives an address signal and chip select signals in response to a chip identification signal and a mode signal used to determine a mono-rank or multi-ranks. The plurality of memory layers operate as the mono-rank accessed by the address signal, or operate as the multi-ranks accessed by the chip select signals.

Semiconductor devices compatible with mono-rank and multi-ranks

A multi-chip package is provided. The multi-chip package includes a plurality of chips including at least one bad chip and at least one good chip that are stacked and a plurality of through electrodes each penetrating the chips. A logic circuit included in the at least one bad chip is isolated from each of the plurality of through electrodes.

Multi chip package, manufacturing method thereof, and memory system having the multi chip package

A semiconductor package substrate may include a first semiconductor chip, a second semiconductor chip, plugs and interconnection terminals. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The first and second semiconductor chips may have corresponding first regions and corresponding second regions. Conductive plugs may be built only in a first region of the first semiconductor chip. Circuitry of the second semiconductor chip may only be electrically connected to the first semiconductor chip through the conductive connectors corresponding to the first regions of the first and second semiconductor chips.

Semiconductor package

A stacked semiconductor memory device is provided which includes a first memory chip including a first transmission line, a second transmission line, and a logic circuit configured to execute a logic operation on a first signal of the first transmission line and a second signal of the second transmission line. The stacked semiconductor memory device further includes a second memory chip stacked over the first memory chip, an inter-chip connection unit electrically coupled between the second memory chip and the first transmission line of the first memory chip, and a dummy inter-chip connection unit electrically coupled to the second transmission line of the first memory chip and electrically isolated from the second memory chip.

Stacked memory device having inter-chip connection unit, memory system including the same, and method of compensating for delay time of transmission line

Growing community of inventors

Seongnam-si, South Korea

Hoon Bok Lee