Hrl Laboratories, LLC

Raytheon Company

Gm Global Technolgoy Operations, Inc.

Cubic Corporation

Teledyne Scientific and Imaging, LLC

Hooman Kazemi

Keisuke Shinohara

Miroslav Micovic

Andrea Corrion

Paul B Hashimoto

Shawn D Burnham

Peter J Willadsen

Hasan Sharifi

Jongchan Kang

Wonill Ha

Dean C Regan

Charles McGuire

Robert G Nagele

Mary C Montes

Jason W May

Shuqing Zeng

Heiko Hoffmann

David D Crouch

Daniel J Gregoire

Joseph S Colburn

Thomas E Kazior

Kevin Geary

Ankush Mohan

Chanh Nguyen

Berinder Brar

Mark J Rosker

Alexander Borisovich Brailovsky

Shane A O'Connor

Emily Elswick

Keisuke Shinihara

David Anthony Miller

Yoonyoung Jin

A planar conductive millimeter-wave lens includes: a planar conductive plate with a first surface and a second surface, wherein the first surface is parallel to the second surface; a plurality of openings from the first surface through the planar conductive plate to the second surface, where an axis of each opening is perpendicular to the first surface and the second surface. A size of each opening is a function of a position of said each opening on the planar conductive plate such that an insertion phase collectively imposed by the openings on an incident wave causes the incident wave to pass through the first surface and the planar conductive plate, exit from the second surface and to focus at a predetermined distance from the second surface.

Planar metal Fresnel millimeter-wave lens

An apparatus includes at least one transmitter configured to transmit wireless signals that create different localized heating in different portions of a scene. The different localized heating in the different portions of the scene is based on different moisture or liquid content within objects in the scene. The apparatus also includes at least one controller configured to control the at least one transmitter in order to control the different localized heating in the different portions of the scene and to create a desired thermal radiation pattern in the scene. The desired thermal radiation pattern in the scene may include a camouflage pattern that increases clutter in an infrared image, at least one temporary infrared marker, or at least one false shape in an infrared image. The desired thermal radiation pattern could reduce a contrast between a cold infrared background in the scene and one or more targets in the scene.

Active multi-spectral system for generating camouflage or other radiating patterns from objects in an infrared scene

A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is enclosed in a space defined by the respective aperture and the second substrate. The module includes a lid and at least one mode suppression circuit disposed in the lid. The modules may include an invariant die where different technologies are stacked together.

Wafer structure with mode suppression

An apparatus includes at least one transmitter configured to transmit wireless signals that heat objects in a scene and cause the objects to radiate thermal energy and create a pattern of thermal radiation in the scene. The apparatus also includes at least one controller configured to control the at least one transmitter in order to control the creation of the pattern of thermal radiation in the scene. The pattern of thermal radiation in the scene could include a camouflage pattern that increases clutter in an infrared image of the scene, at least one temporary infrared marker, or at least one false shape in an infrared image of the scene. The pattern of thermal radiation in the scene could reduce a contrast between a cold infrared background in the scene and one or more targets in the scene.

Devices and methods for manufacturing RF circuits and systems in both passive and active forms are contemplated herein. Exemplary devices include 3D electrical and mechanical structures which are created from individual slices which may be assembled to create a final functional block such as a circuit, component or a system. The slices may fabricated by a variety of manufacturing techniques, such as micromachined layer-by-layer metal batch processing.

Systems and methods for manufacturing stacked circuits and transmission lines

An electronic circuit comprising: an integrated circuit chip, the integrated circuit chip having a top face; portions of the top face of the chip being covered by a first metal layer electrically connected to the integrated circuit; and a dialectic layer formed on the top face of the chip beside and on top of said first metal layer; wherein the dielectric layer extends parallel to the top face of the chip beyond the edges of the chip, the first metal layer extending in the dielectric layer beyond the edges of the chip; and wherein portions of a top surface of the dielectric layer are covered by a second metal layer, portions of the first and second metal layers being electrically connected through the dielectric layer.

Flexible electronic circuit and method for manufacturing same

A flexible, printable antenna for automotive radar. The antenna can be printed onto a thin, flexible substrate, and thus can be bent to conform to a vehicle body surface with compound curvature. The antenna can be mounted to the interior of a body surface such as a bumper fascia, where it cannot be seen but can transmit radar signals afield. The antenna can also be mounted to and blended into the exterior of an inconspicuous body surface, or can be made transparent and mounted to the interior or exterior of a glass surface. The antenna includes an artificial impedance surface which is tailored based on the three-dimensional shape of the surface to which the antenna is mounted and the desired radar wave pattern. The antenna can be used for automotive collision avoidance applications using 22-29 GHz or 76-81 GHz radar, and has a large aperture to support high angular resolution of radar data.

Flexible artificial impedance surface antennas for automotive radar sensors

An electronic circuit comprising: an integrated circuit chip, the integrated circuit chip having a top face; portions of the top face of the chip being covered by a first metal layer electrically connected to the integrated circuit; and a dielectic layer formed on the top face of the chip beside and on top of said first metal layer; wherein the dielectric layer extends parallel to the top face of the chip beyond the edges of the chip, the first metal layer extending in the dielectric layer beyond the edges of the chip; and wherein portions of a top surface of the dielectric layer are covered by a second metal layer, portions of the first and second metal layers being electrically connected through the dielectric layer.

The interface resistance between the source/drain and gate of an HFET may be significantly reduced by engineering the bandgap of the 2DEG outside a gate region such that the charge density is substantially increased. The resistance may be further reduced by using an n+GaN Cap layer over the channel layer and barrier layer such that a horizontal surface of the barrier layer beyond the gate region is covered by the n+GaN Cap layer. This technique is applicable to depletion and enhancement mode HFETs.

Apparatus and method for reducing the interface resistance in GaN Heterojunction FETs

Described is a pattern matching system for matching a test image with a 3D template. The system is initiated by generating a library of templates (each individual template is a three-dimensional array, with each pixel in the array representing a value at a particular x, y, and z coordinate). Each column of pixels along one axis (e.g., z) is converted into a neural input. Each neural input is fed through a neural network to establish a delayed connection between each neural input and output neuron and to generate a template neural network. Separately, a test image is converted into neural inputs. The neural inputs of the test image are input the template neural network to generate output neurons. The output neurons are evaluated to identify a location of the template in the test image.

System and method for fast template matching in 3D

A method of fabricating a GaN HEMT includes growing a first epitaxial layer on a substrate, growing a second epitaxial layer on the first epitaxial layer, growing a third epitaxial layer on the second epitaxial layer, depositing a first dielectric film on the third epitaxial layer, using dielectric films to form a first sidewall dielectric spacer, forming a sidewall gate adjacent the first sidewall dielectric spacer. The sidewall gate may be made to be less than 50 nm in length.

Self-aligned sidewall gate GaN HEMT

The present invention relates to fabrication of enhancement mode and depletion mode High Electron Mobility Field Effect Transistors on the same die separated by as little as 10 nm. The fabrication method uses selective decomposition and selective regrowth of the Barrier layer and the Cap layer to engineer the bandgap of a region on a die to form an enhancement mode region. In these regions zero or more devices may be fabricated.

Enhancement and depletion mode GaN HMETs on the same substrate

Apparatus and method for reducing the interface resistance in GaN heterojunction FETs

Self aligned sidewall gate GaN HEMT

The disclosure relates to a zero-bias heterojunction diode detector with varying impedance. The detector includes a substrate supporting a Schottky structure and an Ohmic contact layer. A metallic contact layer is formed over the Ohmic layer. The Schottky structure comprises a plurality of barrier layers and each of the plurality of barriers layers includes a first material and a second material. In one embodiment, the composition percentage of the second material in each of the barrier layers increases among the plurality of barrier layers from the substrate to the metal layer in order to provide a graded periodicity for the Schottky structure.

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Thousand Oaks, CA, United States of America

Hooman Kazemi