International Business Machines Corporation

Hoodin Hamidi

Robert G Biskeborn

Jason Liang

Sassan K Shahidi

Edwin Ralph Childers

Kevin Thuy Luong

Annayya P Deshpande

Icko E Iben

Abel J Taina

Icko E T Iben

Gary Decad

Calvin S Lo

Philipp Herget

Larry LeeRoy Tretter

William Marvin Dyer

David H F Harper

David Harper

Donald Charles Acosta

Icko Et Iben

Daniel Brown

Cory Yee

In a module of a tape head having multiple modules, a beam support member of at least one module has an alignment leg portion projecting from a body portion of the beam support member at a position displaced from the ends of the beam support member. The alignment leg of one module is matched with the alignment leg of another module to maximize glue adhesion between the legs and minimize positional drifting of the modules after glue curing in a staggered orientation. In another aspect, the support surface of a beam support member of a tape head module extends beyond the end of the wafer chiplet disposed on the beam support member to fully support the wafer chiplet. In still another aspect, one end of a beam support member of a tape head module is chamfered to facilitate mounting the tilted tape head assembly into a tape drive actuator.

Beam support for staggered modules of a tilted head in a storage system

Provided are devices for use in a magnetic tape head, a magnetic tape head, and methods for forming the same. A device includes a chiplet including at least one of a reader and a writer. The device also includes an electromagnetic interference (EMI) shield embedded in the chiplet. The EMI shield is configured to inhibit electromagnetic interference during operation of the at least one of the reader and the writer.

Embedded electromagnetic interference shield

Provided are a magnetic tape head, a magnetic tape drive, and a computational device in which the magnetic tape head is comprised of a plurality of modules comprising reader modules and writer modules, and a plurality of elements, wherein a total of shifts of selected elements of the plurality of elements that are shifted add up to a desired total shift to realign the plurality of modules, such that a median head span of each module type matches as close as possible to a desired value of a head span for all module types including the reader modules and the writer modules and wherein the head span is shifted at a wafer level.

Mechanism to shift the head span of a tape head at a wafer level

An apparatus includes a beam, a chip coupled to the beam, a cable coupled to the beam by a first material located at opposite edges of the cable, and wire bonds extending from pads of the cable to pads of the chip. An apparatus includes a beam and a chip coupled to the beam. The chip includes an array of magnetic transducers for transducing data on a magnetic recording tape. The apparatus includes a cable coupled to the beam by a first material located at opposite edges of the cable, wire bonds extending from pads of the cable to pads of the chip, and a second material encapsulating ends of the wire bonds that are located adjacent the cable. The second material does not contact the chip.

Cable bonding protection for head dimensional stability

An electrical cable including four copper layers, where at least two of the four copper layers are separated by a polymeric base layer, and where at least two of the four copper layers are separated by an adhesive. The electrical cable further includes a polymeric cover layer adhered to an outermost copper layer.

Flexible electrical cable with four copper layers

Provided are a magnetic tape head, a magnetic tape drive, and a computational device in which the magnetic tape head is comprised of a plurality of elements, wherein a pitch between adjacent elements of the plurality of elements is not identical. Selected elements of the plurality of elements that are shifted from a nominal position are selected in a symmetrical manner in the plurality of elements. A total of shifts of the elements of the plurality of elements that are shifted add up to a desired total shift to realign a plurality of modules, such that the median head span of each module type match as closely as possible to a desired value of a head span for all module types.

An apparatus, in accordance with one approach, includes a receiving area configured to receive a plurality of tape spool pairs. A drive mechanism is configured to selectively drive the tape spool pairs. A magnetic head configured to perform data operations on magnetic recording tapes of the tape spool pairs is also present. A positioning mechanism is configured to selectively align the magnetic head to a selected one of the tape spool pairs. An engagement mechanism is configured to create a relative movement between the magnetic head and the magnetic recording tape of the selected tape spool pair for engaging the magnetic recording tape with the magnetic head. A controller is configured to instruct the drive mechanism to drive the selected tape spool pair during performance of data operations on the selected tape spool pair, and to instruct the drive mechanism to drive a second tape spool pair for performing a second operation on the second tape spool pair while the data operations are being performed.

Multi-spool tape recording apparatus

An apparatus, in accordance with one approach, includes a receiving area configured to receive a plurality of mounts, each mount being configured to support at least one tape spool pair thereon. A magnetic head is configured to perform data operations on magnetic recording tapes of the tape spool pairs. A positioning mechanism is configured to selectively align the magnetic head to a selected one of the tape spool pairs. A product apparatus, in accordance with another approach, includes a mount having a tape spool pair thereon. The mount is configured to be inserted in a receiving area of an apparatus configured to receive a plurality of mounts.

Multi-spool tape recording apparatus having removable mounts for supporting tape spool pairs

An apparatus, according to one embodiment, includes at least one reading die coupled to a pedestal of an associated read beam, each reading die having an array of read transducers extending parallel to a longitudinal axis of the reading die. At least one writing die is coupled to a pedestal of an associated write beam, each writing die having an array of write transducers extending parallel to a longitudinal axis of the writing die. The read and write beams are coupled together thereby forming a head. At least one region of at least one of the dice is cantilevered over the associated beam. Widths of the reading and writing dice measured in a direction of tape travel thereover are substantially the same. Widths of the pedestals of the read and write beams measured in the direction of tape travel thereover are substantially the same.

Reduced-stress tape head module

An apparatus, in accordance with one approach, includes a receiving area configured to receive a plurality of tape spool pairs. A drive mechanism is configured to selectively drive the tape spool pairs. A magnetic head configured to perform data operations on magnetic recording tapes of the tape spool pairs is also present. A positioning mechanism is configured to selectively align the magnetic head to a selected one of the tape spool pairs. An engagement mechanism is configured to create a relative movement between the magnetic head and the magnetic recording tape of the selected tape spool pair for engaging the magnetic recording tape with the magnetic head.

A flex circuit for connection to a moving device. The flex circuit includes a connections tab configured to present first and second pluralities of electrical conductors for electrically coupling to the moving device. First and second flex circuit paths extend from the connections tab and having separate distal ends, and include the first and second pluralities of electrical conductors, respectively. The first and second flex circuit paths are configured at their distal ends to present the first and second pluralities of electrical conductors, respectively, for electrical coupling to a circuit board.

Dual-path flex circuit

An assembly according to one embodiment includes a first module and a second module each having multiple transducers, wherein the first module is movable relative to the second module; a tape dimensional stability compensation mechanism for tilting the modules to control a transducer pitch presented to a tape; and an actuator adapted to exert a force on both modules for causing the relative movement of the first module with respect to the second module for aligning the transducers of the first module with the transducers of the second module in a direction of tape travel thereacross.

Tape head actuator

A mechanism for protecting an electronic component from electrostatic discharge (ESD) damage. The system includes a cable adapted for coupling to an electronic device, the cable having multiple traces therein adapted for electrical communication with components of the electronic device. The cable has a window therein positioned between opposite ends of the cable. Portions of the traces are exposed in the window. A protective member is insertable in the window of the cable, the protective member having a conductive portion engaging the traces of the cable when inserted in the window of the cable for creating a short between at least some of the traces.

Reusable ESD shorting member and cable

A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

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San Francisco, CA, United States of America

Hoodin Hamidi