Western Digital Technologies, Inc.

Honny Chen

Cong Zhang

Yazhou Zhang

Hope Chiu

Chin Tien Chiu

Jiandi Du

Fen Yu

Shiv Kumar

Ada Shen

Gary Zheng

A semiconductor device package includes a substrate, a heat-generating component positioned on a surface of the substrate, and an encapsulant at least partially covering the heat-generating component and having an outer surface. A first heat-conducting layer is disposed between the encapsulant and the first heat-generating component. One or more pillars are in contact with the first heat-conducting layer and extend to the outer surface of the encapsulant and contact a second heat-conducting layer disposed on the outer surface of the encapsulant.

Semiconductor device package having thermally conductive layers for heat dissipation

A semiconductor device and a fabricating method of semiconductor device are disclosed. The semiconductor device includes: a substrate having a bonding pad on a surface of the substrate; at least two semiconductor components each having a first surface and a second surface opposite the first surface, the semiconductor components stacked on top of each other on the surface of the substrate via a layer of component attach material attached on the second surface of the respective semiconductor component; an integral through via hole extending completely through the semiconductor components and the layers of component attach material and having a substantially uniform diameter along an extending direction of the integral through via hole aligned with the bonding pad on the surface of the substrate, and a continuous conductive material filled in the integral through via hole and in physical and electrical contact with the bonding pad of the substrate.

Semiconductor device including stacked die with continuous integral via holes

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Shanghai, China

Honny Chen