Finisar Corporation

Ii-vi Delaware, Inc.

Finisar Corporaiton

Hongyu Deng

Maziar Amirkiai

Tao Wu

Yunpeng Song

Jan Lipson

Thomas Lenosky

Mark J Donovan

Jianwei Mu

Frank Lei Ding

Martin Andre Kalberer

Yuri Vandyshev

Lewis B Aronson

Giorgio Giaretta

Darin James Douma

Yongsheng Liu

Shanshan Zeng

Peter Henry Mahowald

Ralph Herbert Johnson

Ying Liu

Tengda Du

Chun Lei

The 'Linh Nguyen

Michael Anton Steib

Wendy Lau Pei Fen

Xiaogang Hong

Chunxiang Zhang

A chip may include a first substantially planar isolation layer with a first surface and a second surface opposite the first surface. The chip may include a first substantially planar conduction layer with a first surface positioned adjacent to the second surface of the first isolation layer and a second surface opposite the first surface. The chip may include a second substantially planar isolation layer with a first surface positioned adjacent to the second surface of the first conduction layer and a second surface opposite the first surface. The chip may include a second conduction layer etched on the second surface of the second isolation layer. The second conduction layer may include an anode trace, a cathode trace, and an optical transmitter positioned on the cathode trace. The chip may include one or more vias through the second isolation layer electrically coupling the anode trace with the first conduction layer.

Chip on carrier

A communication module may include a communication ground layer. The communication module may also include a circuit board. The circuit board may be located proximate the communication ground layer. The circuit board may include a stitch layer. The stitch layer may be electrically coupled to the communication ground layer via a plurality of stitch layer vias. Additionally, the communication module may include multiple ground vias. The ground vias may be electrically coupled to a portion of the circuit board and to the communication ground layer.

Communication module packaging

A resistance weldable cover for an OSA may include multiple walls, one or more supports, and an opening disposed in one of the walls. The walls may define an interior cavity within the walls. The one or more supports may extend from one or more of the walls. Each of the one or more supports may be weldable to a heat sink stiffener. The opening may be sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel.

Horizontal flex circuit with resistance weldable cover

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

Optoelectronic subassembly with components mounted on top and bottom of substrate

In one embodiment, an optoelectronic assembly may include at least one transmitter or at least one receiver, a sleeve, a housing, a fiber stub, and a receptacle. The sleeve may define a sleeve opening sized and shaped to receive an optically transmissive portion of an optical fiber. The housing may define a housing cavity at least partially enclosing the transmitter or the receiver. The housing may include a lens port defining a lens port opening. The fiber stub may be positioned at least partially in the sleeve opening and the lens port opening. The receptacle may define a receptacle opening. The lens port, the sleeve and the fiber stub may be positioned at least partially in the receptacle opening.

Connector assemblies for optoelectronic modules

An optical transmitter may include a transmit laser assembly configured to emit multiple light beams. The optical transmitter may additionally include an isolator configured to rotate a corresponding polarization state of each of the multiple light beams. The optical transmitter may additionally include a power multiplexing combiner configured to receive the multiple light beams from the isolator and combine the multiple light beams into a combined light beam. The optical transmitter may additionally include a lens configured to focus the combined light beam onto an optical fiber for transmission.

Optical transmitters

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to ferrule assemblies and/or ferrule alignment assemblies. In some aspects, the disclosed devices and methods may relate to a ferrule assembly including: optical fibers, an upper clamp member and a lower clamp member configured to retain the optical fibers that are positioned between the upper and lower clamp members, and a ferrule body surrounding at least a portion of the upper and lower clamp members; and an alignment sleeve including a sleeve cavity configured to receive the ferrule body such that the ferrule assembly is capable of being longitudinally repositioned with respect to the alignment sleeve.

Ferrule assemblies

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.

Multi-layer substrates including thin film signal lines

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to lens receptacles and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods relate to a lens receptacle including a receptacle body extending between a receptacle top and a receptacle bottom, the receptacle body including: a port body defining a receptacle port with a port opening at the receptacle top; a receptacle window defining a base of the receptacle port; a lens array including lenses positioned on the receptacle window; and at least one receptacle alignment feature.

Lens receptacles

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to multi-lens optical components and/or optoelectronic subassemblies. In some aspects, devices and methods relate to an optical component including a housing defining a cavity and a lens array having a plurality of lenses on an optically transmissive portion of the housing. In some aspects, devices and methods relate to an optical component including a substrate; and a lens array on the substrate, the lens array having a plurality of discrete lenses.

Multi-lens optical components

A method may include selecting a transistor-outline can (TO-can) assembly cap. The method may further include welding the TO-can assembly cap to a rim that surrounds an optical opening of an optical subassembly box (OSA) such that the TO-can assembly cap hermetically seals the optical opening and allows optical signals to pass through the TO-can assembly cap and the optical opening.

Hermetically sealing an optical subassembly

A system may include a first light source configured to generate a first beam of light at a first wavelength; a second light source configured to generate a second beam of light at a second wavelength; a third light source configured to generate a third beam of light at a third wavelength; and a fourth light source configured to generate a fourth beam of light at a fourth wavelength. The system may also include a thin-film filter, a first polarization beam splitter (PBS), a wave plate and a second PBS. The thin-film filter, the first PBS, the wave plate, and the second PBS may be configured to combine the first beam, the second beam, the third beam and the fourth beam into a combined beam of light.

Wavelength division multiplexing

A circuit may include a first transmission line that includes a first first-line conductor configured to transport a signal and a second first-line conductor. The circuit may also include a second transmission line that includes a first second-line conductor, a second second-line conductor electrically coupled to the second first-line conductor, and a third second-line conductor separated from and positioned between the first and second second-line conductors. The third second-line conductor may be electrically coupled to the first first-line conductor. The circuit may also include a conductive jumper electrically coupling the first and second second-line conductors. The conductive jumper may contact the first and second second-line conductors in a position near the coupling of the first and second transmission lines.

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Saratoga, CA, United States of America

Hongyu Deng