Dow Global Technolgoies LLC

Rohm and Haas Company

Dow Silicones Corporation

Ddp Specialty Electronic Materials Us, LLC

Blue Cube IP LLC

Shanghaitech University

Dow Global Technologies LLC (dgtl)

Hongyu Chen

Chao He

Yi Zhang

Shih-Yaw Lai

Yuen-Yuen D Chiu

Rajen M Patel

Yabin Sun

Huan Chen

Mark Alan Barger

Shaofu Wu

Yunfeng Yang

Hong Peng

Ashish Sen

Jeffrey Morris Cogen

Yunwa Wilson Cheung

Benjamin C Poon

Andong Liu

Mohamed Esseghir

Timothy James Person

Antonios K Doufas

Andy Cheng Chang

Haiyang Yu

Yong Chen

Hong Yang

Weiming Ma

Jiguang Zhang

Yan Huang

Xiao Bing Yun

Jianping Pan

Wenjie Chen

Yu Zhang

Yu Cai

Thoi H Ho

Charles F Diehl

Kalyan Sehanobish

Lei Huang

Chao B Zhang

Zhihua Liu

Yan Zhou

Tao Han

John Klier

Jian Zou

Dorab Edul Bhagwagar

Yan Zheng

Gangwei Sun

Eddy I Garcia-Meitin

Thomas Allgeuer

Yonghua Gong

Kainan Zhang

Chenyan Bai

Yahong Zhang

Kyle G Kummer

Yi Guo

Bharat Indu Chaudhary

Wei Zhang

Tao Wang

Jing Li

Min Yang

Michael J Mullins

Yu Chen

Brian W Walther

Jun Yang

Yu Wang

David L Malotky

Shaoguang Feng

Morgan Mark Hughes

Li Ding

Jorge Caminero Gomes

Ronald Wevers

Christopher John Tucker

Hui Liu

Nanguo Liu

Ling Li

Peng Gao

Paul Joseph Popa

Alvin Michael Maurice

Zheng Zhang

Nick Evan Shephard

Jianming Xu

Brad C Bailey

Bin Chen

Yujiang Wang

Yajun Ha

Zhaohui Qu

Suh Joon Han

John Anderson Roper, Iii

Cheng Shen

Xiucuo Li

Jie Wu

Alexander Williamson

Jianfeng Huang

David G McLeod

Thorsten Schmidt

Mark B Wilson

Zhengming Tang

Todd D Senecal

Jose Manu Rego

Peng Wei

John A Naumovitz

Chao Zhang

Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.

Thermal interface material with low dispensing viscosity, low vertical flow after dispensing, and low thermal impedance after cure

The present disclosure relates to an encapsulant film made from a curable composition comprising: (A) a polyolefin polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a monocyclic organosiloxane of formula (I).

Polyolefin compositions for photovoltaic encapsulant films

A composition for use as a film layer comprises (A) an olefin-based polymer having a volume resistivity greater than 5.0*10ohm·cm; (B) a hydrophilic fumed silica; (C) an alkoxysilane; (D) an organic peroxide; and, optionally, (E) from 0 wt % to 1.5 wt % of a crosslinking co-agent.

PV module with film layer comprising hydrophilic fumed silica

An ultra-low-voltage static random access memory (SRAM) cell for eliminating half-select-disturbance under a bit interleaving structure includes a cross-coupled inverter pair, two N-type write transistors NMand NM, two P-type write transistors PMand PM, and two N-type transistors NMand NM, where the two N-type transistors NMand NMform a readout path. The present disclosure can be applied to applications with a storage requirement at an ultra-low voltage, especially applications with certain requirements for an access speed and reliability of an SRAM at a low voltage. Compared with other different SRAM cells, the ultra-low-voltage SRAM cell can achieve higher read and write working frequencies with similar energy consumptions.

Ultra-low-voltage static random access memory (SRAM) cell for eliminating half-select disturbance under bit interleaving structure

A polyurethane composition is provided. The polyurethane composition comprises (A) a polyurethane-prepolymer prepared by reacting at least one polyisocyanate compound with a first polyol component; and (B) a second polyol component; wherein at least one of the first polyol component and the second polyol component comprises an ester/ether random copolymer polyol synthesized by reacting a starting material polyether polyol with at least one monomeric polyhydric alcohol and at least one monomeric multifunctional carboxylic acid or anhydride thereof. The polyurethane foam prepared by using the polyurethane composition can achieve inhibited internal heat buildup, high thermal stability, superior tear strength, enhanced abrasion resistance and good hydrolysis resistance. A polyurethane product prepared with said foam, a method for preparing the polyurethane foam and a method for improving the performance property of the polyurethane foam are also provided.

Polyurethane compositions, products prepared with same and preparation methods thereof

Chemical foaming agents having p-toluenesulfonyl groups. Processes for preparing foamed polyolefin compositions using chemical foaming agents having p-toluenesulfonyl groups. Articles of manufacture containing formed polyolefins prepared using chemical foaming agents having p-toluenesulfonyl groups.

Chemical foaming agents containing tosyl groups

The present disclosure provides a crosslinked polymeric composition. The crosslinked polymeric composition contains (A) a silane functionalized ethylene-based polymer and (B) inorganic hollow microspheres having (i) a Dparticle size from 10 μm to 100 μm, (ii) a crush strength from 17 MPa to 140 MPa, and (iii) a density from 0.10 g/cc to 0.40 g/cc. The crosslinked polymeric composition has a tensile strength from 11 MPa to 40 MPa and a tensile elongation from 12% to 100%.

Crosslinked polymeric composition and coated conductor

An adhesive composition including a reaction mixture of: (A) at least one isocyanate-containing compound; (B) at least one polyol compound; and (C) a copolymerized crystalline latent catalyst; a process for making the above adhesive composition; and a laminate structure made using the above adhesive composition.

Adhesive composition

A process for preparing a waterborne dispersion of a silicone pressure sensitive adhesive base includes the use of a solventless polyorganosiloxane pellet containing a polyorganosilicate resin and a polyorganosiloxane gum. The waterborne dispersion of the silicone pressure sensitive adhesive base can be combined with a free radical initiator, and dried and cured to form a silicone pressure sensitive adhesive.

Process for preparing a solventless polyorganosiloxane pellet and a waterborne dispersion of a silicone pressure sensitive adhesive base

A composition comprising at least the following components: A) an olefin multi-block copolymer; and B) a silicone rubber that comprises pendant vinyl groups, and optionally comprises terminal vinyl groups.

Olefin multi-block copolymer / silicone rubber compositions and foams formed from the same

A polyolefin and polyvinylpyrrolidone formulation including (A) an olefin-based (co)polymer, (B) a polyvinylpyrrolidone (co)polymer, and (C) an antioxidant. Also a method of making the composition; a crosslinked polyolefin product made by curing the composition; manufactured articles including a shaped form of the inventive formulation or product; and methods of using the inventive formulation, product, or articles.

Polyolefin and polyvinylpyrrolidone formulation

A polyolefin-and-poly (2-alkyl-2-oxazoline) formulation comprising (A) an olefin-based (co) polymer, (B) a poly (2-alkyl-2-oxazoline) (co) polymer, and (C) an antioxidant. Also a method of making the composition; a crosslinked polyolefin product made by curing the composition; manufactured articles comprising a shaped form of the inventive formulation or product; and methods of using the inventive formulation, product, or articles.

Polyolefin formulation with poly(2-alkyl-2-oxazoline)

A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.

Thermally conductive composition and methods and devices in which said composition is used

A composition comprising at least the following: A) an olefin multi-block copolymer; B) a silicone rubber; C) a tackifier.

Olefin multi-block copolymer / silicone rubber / tackifier compositions and foams

An aqueous dispersion of a silicone pressure sensitive adhesive base can be combined with a curing agent and cured to form a silicone pressure sensitive adhesive. The aqueous dispersion of the silicone pressure sensitive adhesive base includes a bis-hydroxyl-terminated polydiorganosiloxane; a polyorganosilicate resin; cumene; a surfactant; and water. A curing agent such as a peroxide compound or an aminosilane may be combined with the aqueous disperison of the silicone pressure sensitive adhesive base to form a silicone pressure sensitive adhesive composition. A pressure sensitive adhesive article may be formed by a method including coating a surface of a substrate with the silicone pressure sensitive adhesive composition, removing water, and curing the silicon pressure sensitive adhesive composition to form a silicone pressure sensitive adhesive on the surface of the substrate.

Aqueous dispersion of a silicone pressure sensitive adhesive base and methods for preparation and use of the dispersion

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Shanghai, China

Hongyu Chen