Digital Optics Corporation

The Whitaker Corporation

Tessera North America, Inc.

Digitaloptics Corporation East

Lasertron

Flir Systems Trading Belgium Bvba

Hongtao Han

Michael R Feldman

Robert A Boudreau

Jay Mathews

James E Morris

John R Rowlette, Sr

Terry P Bowen

Alan D Kathman

John Barnett Hammond

Robert D TeKolste

Robert Addison Boudreau, Sr

Adam S Fedor

Jared D Stack

Ping Zhou

Michael Aaron Kadar-Kallen

Randall Brian Wilson

James E Morris, Jr

Songsheng Tan

William Hudson Welch

Robert Te Kolste

Dennis P Bowler

Robert Wallace Roff

Jeremy Huddleston

Paul R Reitz

Thomas J Suleski

Charles S Koehler

Jack H Schmidt

Robert Russell Boye

William F Delaney

John Woodhouse

Hatem Abdelkader

Jared David Stack

Harris Miller

Yinbao Yang

Xiansong Chen

Ervin H Mueller

Narinder Kapany

Barney Hammond

Daniel Pulver

Michael Magoon

James Carriere

Rong Huang

Robert Tekolste

Adam Fedor

Bruce Mcwilliams

An optical device includes a substrate. a non-planar transparent structure on a first surface of the substrate, the non-planar transparent structure being made of a first material, and a molded refractive surface on the first surface of the substrate adjacent the non-planar transparent structure, the molded refractive surface being made of a second material, different from the first material.

Optical device including at least one replicated surface and associated methods

An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

Optical assembly

Optical assembly and method of making same

Optical wavelength division coupler and associated methods

A waveguide to waveguide monitor includes an optics block between the two waveguides. The optics block couples light between the two waveguides and includes at least two parallel surfaces. The monitor also has an optical tap which creates a monitor beam. The optics block may be flush with the endfaces of the waveguides, even if the endfaces are angled. At least two optical elements needed to couple the light between the two optical waveguides and direct the monitor beam on a detector are on the at least two parallel surfaces of the optics block and any surfaces secured thereto.

Waveguide to waveguide monitor

A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.

Separating of optical integrated modules and structures formed thereby

Etching in combination with other processing techniques is used to facilitate alignment of an optical die in an optical system. The optical dies are formed on a wafer level and need to be singulated for use in the optical system. The formation of a precise edge from etching allows more accurate alignment of the optical die in the optical system. The other processing techniques include dicing, sawing, cleaving, breaking and thinning.

Etching in combination with other processing techniques to facilitate alignment of a die in a system and structures formed thereby

A passive optical element is transferred into a substrate already having features with a vertical dimension thereon. The features may be another passive optical element, an active optical element, a dichroic layer, a dielectric layer, alignment features, metal portions. A protective layer is provided over the feature during the transfer of the optical element. One or more of these processes may be performed on a wafer level.

Transfer of optical element patterns on a same side of a substrate already having a feature thereon

A thick wafer is diced by partially dicing a first side to form a first dice, flipping the wafer so that the first side is now in contact with a dicing tape, and dicing a second side. The dicing of the second side may be achieved by aligning a dicing tool to the first dice and/or alignment marks on the wafer. The thick wafer may be a composite wafer including two or more wafers bonded together. These two wafers may be different thicknesses and/or different materials.

Thick wafer processing and resultant products

An etalon used in analyzing a wavelength of a light source includes ant etalon only in a portion of a substrate in which the etalon is integrated. Use of such an etalon in monitoring or controlling the wavelength allows the etalon to be placed in an application beam. A portion of the application beam is split into at least two beams, a first beam being directed to the etalon to monitor the wavelength, and the other beam either serving purely as a reference beam or passing through another etalon having a different optical path length than the etalon for the first beam, thereby also monitoring the wavelength. The monitor itself would include at least two photodetector, one for each of the beam split off of the input beam. Any or all substrates containing the elements for the monitor may be created on a wafer level and diced and/or bonded to other wafers containing other elements and diced.

Etalon, a wavelength monitor/locker using the etalon and associated methods

An optical subassembly includes an opto-electronic device, an optics block and a spacer, separate from the optics block and providing spacing between the opto-electronic device and the optics block. The opto-electronic device, the optics block and the spacer are aligned and bonded together. This subassembly is particularly useful when coupling light between the opto-electronic device and a fiber. The optical subassembly may also include an opto-electronic device, an optics block and a sealing structure surrounding the opto-electronic device. The opto-electronic device, the optics block and the sealing structure are aligned and bonded together.

Optical subassembly

A power monitor for a light emitter uses an absorptive material placed in the path of the application beam. The absorptive has a measurable characteristics thereof altered by an intensity of the light beam, the absorptive material being thin enough to allow a portion of the light beam sufficient for a desired application to be passed to the desired application. Preferably, an anti-reflective coating is placed between the absorptive material and the light emitting device. The absorptive material may be formed directly on the light emitting device or may be formed on or integrated with a spacer.

Transmission detection for a laser power monitor and system

Arrays of non-rod shaped optical elements may be integrated with fiber arrays arranged in a positioning structure. The use of non-rod shaped optical elements allow the elements to be lithographically created already accurately aligned relative to one another. This also allows for simultaneous alignment of the array of optical elements with the array of fibers. The arrays may be one or two dimensional. The support structure for the fibers may be any desired structure. The fiber endfaces may be angled. The array of optical elements may include more than one substrate bonded together. Passive alignment features, including visual alignment marks and/or mechanical mating features, may be provided on

Integration of array on non-rod shaped optical elements with array of fibers in a structure and associated methods

An interface system includes separate optical and mechanical interfaces between opto-electronic devices and fibers. This allows each of these components to be optimized for there particular function. This also allows two surfaces to be provided for the optical interface, allowing the opto-electronic elements to be spaced further apart than the fibers. The interface system can be integrated together, used in conjunction with a conventional fiber housing, and can be surface mounted with an electrical interface.

Interface between opto-electronic devices and fibers

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Mooresville, NC, United States of America

Hongtao Han