Seagate Technology Incorporated

Wd Media, LLC

Hongling Liu

Tatsuru Tanaka

Chang Bok Yi

Paul Stephen McLeod

Yew Ming Chiong

Noe D Taburaza

Chun Wai Joseph Tong

Phi Cam Ha

A cryogenic dynamic cooling apparatus and a cooling method for heat assisted magnetic recording media substrate are provided. The cooling apparatus includes a chamber that is configured to receive a substrate. A substrate holder secures the substrate inside the chamber. The apparatus has a cooling plate that is movable between a retracted position and an extended position inside the chamber. The cooling plate provides clearance for movement of the substrate holder inside the chamber in the retracted position, and the cooling plate cools the substrate in the extended position. Also, the cooling plate is substantially parallel to and spaced apart from the substrate. The apparatus further includes a cryogenic operatively coupled to the cooling plate that is cooled by the cryogenic cooling element.

Method and apparatus for cryogenic dynamic cooling

Methods and apparatus are provided for static-biasing a pre-metalized non-conductive substrate within a process chamber. A substrate holder that holds a pre-metalized non-conductive substrate is engaged by a lift mechanism that provides movement of the substrate in a first, upward direction to a contact position within the process chamber and in a second direction to a non-contact position. When the substrate holder is moved to the contact position, the substrate electrically engages a conductive spring-loaded compliance mechanism that is mounted in a fixed position within the process chamber. The spring-loaded compliance mechanism is connected to a bias-voltage feed-through for the process chamber that applies a bias voltage to the substrate via the spring-loaded compliance mechanism.

Biasing a pre-metalized non-conductive substrate

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Sunnyvale, CA, United States of America

Hongling Liu