Samsung Electronics Co., Ltd.

Hongkook Min

Kyounghwan Kim

Sungkyoo Park

A circuit under pad structure includes a substrate, a pad electrode, wiring layers interlayer insulation layers alternately disposed between the pad electrode and the substrate, and at least one circuit pattern integral with the substrate, disposed beneath the lowermost wiring layer and spanned by the pad electrode. The width of each wiring layer is smaller than the width of the wiring layer beneath it, i.e., closer to the substrate. The structure is fabricated such that it resists cracking, which maximizes its production yield, and possesses a minimal footprint.

Growing community of inventors

Yongin-si, South Korea

Hongkook Min