Samsung Electronics Co., Ltd.

Amotech Co., Ltd.

Hongki Moon

Yoonsun Park

Seunghoon Kang

Kihyun Kim

Hyoseok Na

Jihong Kim

Kyungha Koo

Seyoung Jang

Seungjoo Lee

Jaeyoung Huh

Jonghoon Lim

Boram Kim

Kyungwoo Lee

Ohhyuck Kwon

Daesuk Kang

Hajoong Yun

Wooram Lee

Se-Young Jang

Haejin Lee

Jae-Il Seo

Jongchul Hong

Kuntak Kim

Yoon-Sun Park

Joseph Ahn

Jinmyoung Kim

Hyunjoo Lee

Youngjin Kim

Younho Choi

Inkuk Yun

Sukjin Yun

Yeonjoo Lee

Kyungwan Park

Jinhyoung Lee

Yongjae Song

Chihwan Jeong

Sunghoon Moon

Yunjeong Park

Kyeongsoo Kim

Jiseong Hwang

Youngjae You

Woojune Jung

Seungjae Hwang

Seungbo Hong

Jaewook Jeong

Hyunjin Bai

Jaecheon Kim

An electronic device includes a first housing; a second housing slidable into and out of the first housing; a sliding plate configured to be at least partially slid within the second housing; a flexible display including a display area that is variable as the second housing slides into and out of the first housing; a printed circuit board in an inner space of the first housing; a first shaft; and a thermal diffusion member including a first end, disposed on the at least one electronic component and partially wound, and a second end coupled to the first shaft, and the thermal diffusion member is configured such that at least a portion of the thermal diffusion member spreads out in an inner space of the second housing as a sliding-out operation is performed by the second housing with respect to the first housing.

Electronic device comprising thermal diffusion member

Disclosed is an electronic device including a housing including a first surface, a second surface facing away the first surface, and a third surface surrounding a space between the first surface and the second surface; a display exposed through the first surface; a battery disposed in the space; a heating source disposed between the battery and the third surface; and a thermal diffusion member disposed between the heating source and the battery. The thermal diffusion member includes a fluid; a first portion disposed adjacent to the heating source for receiving heat from the heating source; and at least one second portion extending from the first portion. The heat transferred from the heating source to the first portion is transferred from the first portion to the at least one second portion.

Electronic device having thermal diffusion structure

According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

Electronic device including heat dissipation structure

Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.

Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.

Electronic device filled with phase change material between plurality of circuit boards connected by connecting members

An electronic device according to various embodiments of the present disclosure can comprise: a front plate facing a first direction; a rear plate facing a second direction, which is opposite to the first direction; at least one antenna module arranged between the front plate and the rear plate; and at least one heat dissipation sheet spaced from the at least one antenna module so as to be arranged to come in contact with the rear plate. The at least one heat dissipation sheet can comprise a ceramic filler and a binder resin mixed with the ceramic filler.

Heat dissipation sheet and electronic device including same

An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.

Electronic device including vapor chamber

According to various embodiments, a wireless charging device can comprise: a first housing, which includes a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, and includes at least one hole; a second housing arranged on the second surface of the first housing in the second direction; a coil unit arranged between the first housing and the second housing and configured to transmit power to an external device; a shielding member arranged adjacent to the coil unit and including at least one hole; and a fan arranged adjacent to the coil unit and configured to rotate.

Wireless charging device

Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.

A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.

Heat dissipation device formed of nonmetallic material and electronic device including the same

An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.

Camera module including heat dissipating structure and electronic device including the same

An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the display and supporting the display, a printed circuit board on which electronic components are mounted, a shield can surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shield can to shield the electronic components, and a first heat transfer member disposed on an outer surface of the shielding structure and including a partial area that faces at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.

Heat transfer member and electronic device including the same

An electronic device according to various embodiments of the disclosure may include a housing including a front plate and a rear plate facing the front plate, a display exposed through at least part of the front plate, an intermediate plate interposed between the display and the rear plate, and including a first face facing the display and a second face facing the rear plate, a first printed circuit board interposed between the display and the intermediate plate, a first electronic component attached to a first portion of the second face, a second electronic component attached to a second portion, away from the first portion, of the second face, and a first heat-dissipating structure extended between the first portion and the second portion along the second face.

Electronic device comprising heat-dissipating structure

Growing community of inventors

Gyeonggi-do, South Korea

Hongki Moon