Semiconductor Manufacturing International (shanghai) Corporation

Semiconductor Manufacturing International (beijing) Corporation

Hongjun Yu

Shuhui Chen

Hui Qing Shi

Pan Ding

A microphone and its manufacturing method, relating to semiconductor techniques. The microphone comprises a substrate with a back through-hole going through the substrate; a first electrode layer on the substrate covering the back through-hole; a back plate on the substrate, wherein the back plate and the first electrode layer form a cavity, and the first electrode layer comprises a gap connecting the back through-hole and the cavity; and a second electrode layer in the cavity and on a bottom surface of the back plate. In this inventive concept, the gap in the first electrode layer increases the sensitivity of the first electrode layer and thus improves the Signal-to-Noise Ratio (SNR).

Microphone and manufacture thereof

A microphone and its manufacturing method, relating to semiconductor techniques. The microphone comprises a capacitor comprising of a back plate and a vibration film plate, with the vibration film plate comprising a plurality of holes. The holes in the vibration film plate provide a ventilation route for pressured air in the microphone, and thus reduce the pressure on the vibration film plate which otherwise is susceptible to damaged under high air pressure. This inventive concept improves a microphone's acoustic tolerance.

Growing community of inventors

Shanghai, China

Hongjun Yu