Samsung Electronics Co., Ltd.

Hongjoo Baek

Hyuekjae Lee

Eunseok Song

Kyungsuk Oh

Manho Lee

An integrated circuit chip includes a substrate having an active surface and a back surface opposite to the active surface; a front-end-of-line (FEOL) structure disposed on the active surface of the substrate; a first back-end-of-line (BEOL) structure disposed on the FEOL structure; an intermediate connection layer disposed under the back surface of the substrate, the intermediate connection layer including a charge storage, and metal posts disposed around the charge storage; and a re-distribution structure layer disposed under the intermediate connection layer.

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Seongnam-si, South Korea

Hongjoo Baek