Shenzhen Longsys Electronics Co., Ltd.

Huawei Technologies Co., Limited

Honghui Hu

Zhixiong Li

Xiaoqiang Li

Weiwen Pang

Jinmou Qin

Guangqing Liang

A storage apparatus includes a control chip, a storage chip, a power interface configured to receive a first voltage, a first variable-voltage circuit. An input end of the first variable-voltage circuit is coupled to the power interface. The first variable-voltage circuit is configured to convert the first voltage into a second voltage, and provide the second voltage to the control chip and a second variable-voltage circuit, where an input end of the second variable-voltage circuit is coupled to the power interface. The second variable-voltage circuit is configured to convert the first voltage into a third voltage and provide the third voltage to the control chip and the storage chip.

Storage apparatus and electronic device

A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function; the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.

SSD storage module, SSD component, and SSD

A SSD storage module comprising a printed circuit board (), an encapsulating colloid (), and an electronic circuit () welded on an inner surface of the printed circuit board () and having a data storage function; the encapsulating colloid () is formed on the inner surface of the printed circuit board () and is configured for seamlessly encapsulating the electronic circuit (), an outer surface of the printed circuit board () is provided with a plurality of metal contact pieces (), the plurality of metal contact pieces () are electrically connected with the electronic circuit (), and the plurality of metal contact pieces () comprise a plurality of SATA interface contact pieces (). The encapsulating colloid () seamlessly encapsulates the electronic circuit () and isolates the electronic circuit () from the air, such that a problem that the electronic circuit () is directly exposed to the air, and performances of components of the electronic circuit () may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.

Growing community of inventors

Shenzhen, China

Honghui Hu