Intel Corporation

Hongfei Yan

Chunlei Guo

Yuan-Liang Li

Jiangqi He

Russell S Aoki

Jeffory L Smalley

Dimitrios Ziakas

Thomas A Boyd

David J Llapitan

Jonathan W Thibado

Wei Shen

Harvey R Kofstad

Leo Liu

Gang Yuan

Embodiments herein may include apparatuses, systems, and processes related to a socket with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB), which may be a mother board, where the socket has a cavity into which a thermal conductor is inserted to conduct heat from the package substrate to the PCB. In embodiments, the PCB may contain thermal vias to conduct heat from one side of the PCB to the other side. Other embodiments may be described and/or claimed.

Socket with thermal conductor

A method and device for temperature measurement of a processor is disclosed. A temperature-sensing circuit of the processor may have an associated resonance frequency, wherein the resonance frequency depends on a temperature of the temperature-sensing circuit. A temperature of the temperature-sensing circuit may be determined by determining the resonance frequency of the temperature-sensing circuit.

Technologies for temperature measurement of a processor

A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.

Rework grid array interposer with direct power

A test pin includes a compression element (), a first tip () physically coupled to a first end () of the compression element, a second tip () physically coupled to a second end () of the compression element, a first arm () physically coupled to a first side () of the first tip, and a second arm () physically coupled to a second side () of the first tip.

Test pin, method of manufacturing same, and system containing same

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Mesa, AZ, United States of America

Hongfei Yan