Acm Research (shanghai) Inc.

China Unionpay Co., Ltd.

Hongchao Yang

Hui Wang

Jian Wang

Zhaowei Jia

Fuping Chen

Yinuo Jin

Wenjun Wang

Jun Wu

Xiaoyan Zhang

Fufa Chen

Shu Qing Yang

Voha Nuch

Jun Wang

Zhiyou Fang

Chenhua Lu

The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode; step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value Pand continue with a period T; step 3: when the period Tends, adjusting the first plating power supply applied on the first anode to output a power value Pand continue with a period T, at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value Pand continue with a period T; and step 4: when the period Tends, adjusting the second plating power supply applied on the second anode to output a power value Pand continue with a period T; wherein step 2 to step 4 are performed periodically.

Plating apparatus and plating method

A coater with automatic cleaning function and a coater automatic cleaning method. The coater () includes a coater chamber () capable of being filled up with cleaning solution, a substrate chuck () holding and positioning a substrate (), and at least one shroud () capable of moving up for preventing photoresist from splashing out of the coater chamber (), or moving down and immersing into the cleaning solution for cleaning. The coater () automatic cleaning method includes the following steps: turning off a liquid outlet valve (A,B,) of the coater (); filling up a coater chamber () with cleaning solution; after photoresist in the coater chamber () being dissolved into the cleaning solution, turning on the liquid outlet valve (A,B,) and draining the cleaning solution out of the coater chamber ().

Coater with automatic cleaning function and coater automatic cleaning method

Embodiments of the present invention provide an electroplating apparatus for electroplating on a surface of a wafer, which comprising a plurality of electrodes, for forming electric fields on the surface of the wafer, an independent electric field is formed in a designated area, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch is reduced. Embodiments of the present invention also provide an electroplating method for electroplating on a surface of a wafer, the method controlling the plurality of electrodes to form electric fields on the surface of the wafer, an independent electric field is formed in a designated area, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch is reduced. The present invention is more accurate and reliable, the electroplating efficiency is also increased.

Electroplating apparatus and electroplating method

A plating apparatus for depositing metal on a substrate, comprising a membrane frame (), a catholyte inlet pipe () and a center cap (). The membrane frame () has a center passage () which passes through the center of the membrane frame (). The catholyte inlet pipe () is connected to the center passage () of the membrane frame (). The center cap () is fixed at the center of the membrane frame () and covers over the center passage () of the membrane frame (). The top of the center cap () has a plurality of first holes (). The catholyte inlet pipe () supplies catholyte to the center cap () through the center passage () of the membrane frame (), and the catholyte is supplied to a center area of the substrate through the first holes () of the center cap ().

Plating apparatus

The present invention provides a substrate heat treatment apparatus for heat treating a substrate, including a bake plate, support components, a baffle plate, and a driving device. The bake plate defines at least one gas passage. The support components support the substrate. The baffle plate is fixed on a top surface of the bake plate. The baffle plate surrounds the substrate and a gap is formed between an inner circumferential wall of the baffle plate and the substrate. A driving device drives the plurality of support components to move up or down. When heat treating the substrate, a hot gas is supplied to the space between the substrate and the top surface of the bake plate through the gas passage of the bake plate, and the hot gas flows out through the gap formed between the inner circumferential wall of the baffle plate and the substrate.

Substrate heat treatment apparatus

A plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode (); step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value Pand continue with a period T(); step 3: when the period Tends, adjusting the first plating power supply applied on the first anode to output a power value Pand continue with a period T, at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value Pand continue with a period T(); and step 4: when the period Tends, adjusting the second plating power supply applied on the second anode to output a power value Pand continue with a period T; wherein step 2 to step 4 are performed periodically.

A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area () and a patterned region () adjacent to the notch area (). The plating chuck comprises a cover plate () configured to cover the notch area () of the substrate to shield the electric field at the notch area () when the substrate is being plated.

Plating chuck

An apparatus for holding a substrate () has a chuck cup (), a seal shell (), a chuck plate () and a vertical driving device (). The seal shell () has a bottom wall (), an outer wall () and an inner wall (). The inner wall () forms a lip seal portion (). The bottom wall () and the outer wall () of the seal shell () respectively wrap the bottom surface and the outer surface of the base portion () of the chuck cup (). The lip seal portion () wraps the supporting portion () of the chuck cup () for sealing the edge of the front side of the substrate (). The apparatus protects the edge of the front side of the substrate, the back side of the substrate and the chuck cup from contacting with the electrolyte solution.

Apparatus for holding a substrate

The present invention proposes a method for data mining, the method comprising: making statistics of the feature vectors of each target object according to the records in a target data set so as to constitute a rough data set, each of the feature vectors including the value of at least one attribute data of the target objects corresponding thereto; screening the feature vectors which correspond to all known the first type of target objects from the rough data set, and performing a filter operation onto the screened feature vectors to obtain samples; and building a regression model based on the samples, and then using the built regression model to determine whether each of all known the second type of target objects potentially belongs to the first type of target objects. The method for data mining disclosed in the present invention is capable of mining and classifying the target objects according to the comprehensive features of the target objects.

Data mining method

An apparatus and a method for plating and/or polishing wafer includes a wafer chuck, an auxiliary nozzle apparatus and a main nozzle apparatus. The wafer chuck holds and positions the wafer, moves horizontally, and rotates. The auxiliary nozzle apparatus supplies uncharged or charged electrolyte to cover the outer edge of the wafer and the wafer chuck, and the main nozzle apparatus supplies charged electrolyte to the surface of the wafer, to improve the plating and/or polishing uniformity of the outer edge of the wafer, reduce the entire electric resistance of the apparatus, and improve the plating and/or polishing rate.

Growing community of inventors

Shanghai, China

Hongchao Yang