Shenzhen Weitongbo Technology Co., Ltd.

Huke (Singapore) Holding Pte. Ltd.

Hongchao Wang

Jian Shen

Canhong Du

Wenxuan Wang

Chengzuo Wang

Dengxin Ji

Yuwang Xu

The present disclosure provides an ultrasonic fingerprint apparatus and an electronic device. The ultrasonic fingerprint apparatus includes an ultrasonic fingerprint chip and a piezoelectric transducer arranged above the ultrasonic fingerprint chip; the piezoelectric transducer includes a piezoelectric layer, an upper electrode located above the piezoelectric layer, and a lower electrode located below the piezoelectric layer; the ultrasonic fingerprint chip includes a substrate and a plurality of metal layers arranged in a first region of the substrate, the lower electrode is located above a second region of the substrate, a top metal layer among the plurality of metal layers includes N drive traces, a passivation layer is provided above the top metal layer, and provided with a first window corresponding to the N drive traces, and the upper electrode extends from an upper surface of the piezoelectric layer into the first window.

Ultrasonic fingerprint apparatus and electronic device

An e-fuse and a manufacturing method thereof, and a memory cell are provided. The method includes: providing a semiconductor substrate including a preset active region; forming an isolating region on the substrate, where the isolating region and the preset active region have a height difference and are connected by at least one side wall; forming a negative electrode and a positive electrode on the preset active region; and forming a fuse link on the side wall for connecting the negative electrode and the positive electrode. Accordingly, the line width of the fuse link is out of the limitation of the limit line width of the semiconductor process, the actual line width of the e-fuse may be smaller than the limit line width of the semiconductor process, and low fusing current is required for fusing.

E-fuse and manufacturing method thereof, and memory cell

An optical path modulator, applied to a fingerprint identification apparatus, is configured to direct reflected light reflected back from a surface of a finger to an optical detection unit disposed below the optical path modulator, and the optical detection unit is configured to detect the received reflected light, where an array of through holes is arranged between an upper surface and a lower surface of the optical path modulator, and the array of through holes includes a plurality of tilt through holes, where each tilt through hole has a tilt angle greater than 0&#xb0;, and the tilt angle is an angle between an axial direction of the tilt through hole and a normal direction perpendicular to a surface of the optical path modulator. In a case of the same hole depth, a thinner optical path modulator can be obtained.

Optical path modulator and manufacturing method thereof, fingerprint identification apparatus and terminal device

Growing community of inventors

Shenzhen, China

Hongchao Wang