Xerox Corporation

Hong Zhao

Kock-Yee Law

Santokh Singh Badesha

John Richard Andrews

Mandakini Kanungo

Varun Sambhy

Yanjia Zuo

Pratima Gattu Naga Rao

Peter M Gulvin

Mark Anthony Cellura

Bryan James Roof

Jonathan Robert Brick

Tony Russell Rogers

John Milton Brookfield

Michael Joel Edwards

Christopher Jon Laharty

Daniel R Hahn

Sean Campbell Hunter

Paul J McConville

James M Casella

Yuanjia Zhang

Kyoo-Chul Park

Samarth Chugh

David Joseph Gervasi

Michael F Zona

Gerald A Domoto

Terrance Lee Stephens

David Paul Platt

Jun Ma

Bryan R Dolan

Nicholas P Kladias

Bradley James Gerner

Gregory Joseph Kovacs

Antonio L Williams

Charles T Facchini

Darren Smith

Kyoo-Chul Pasrk

A three-dimensional object printing system comprises a ejectors configured to eject drops of material towards a platen, a heater, a sensor configured to sense temperature of the ejected material, a radiator configured to direct radiation to the ejected material, a cooler configured to cool the ejected material, and a controller operatively connected to the ejectors, heater, sensor radiator and cooler. The controller is configured to control the ejectors to form layers of material for a three-dimensional object on the surface of the platen with reference to image data of the three-dimensional object, to operate the heater to heat the surface of the platen, to compare a temperature signal received from the sensor to a predetermined threshold, to operate the radiator to radiate the object layers, and to operate the cooler to attenuate heat produced by the radiated material in response to the signal from sensor exceeding the predetermined threshold.

Thermal management methods and apparatus for producing uniform material deposition and curing for high speed three-dimensional printing

The present teachings describe a printhead assembly. The printhead assembly includes a first plate and a second plate stacked together. The printhead assembly includes a first adhesive between the first plate and the second plate for bonding the plates together. The printhead assembly includes a second adhesive surrounding an outer edge of the first adhesive wherein the second adhesive has an oxygen migration rate lower than an oxygen migration rate of the first adhesive. An oxygen sensitive component is contained within the outer edge of the first adhesive.

Printhead having two adhesives

An adhesive compound can include an uncured epoxy film having a curing temperature between about 80&#xb0; C. and about 300&#xb0; C. The uncured epoxy film can include a cresol novolac epoxy resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.

Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in high density printheads

A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

B-stage film adhesive compatible with aqueous ink for printhead structures interstitial bonding in high density piezo printheads fabrication for aqueous inkjet

An adhesive compound can include an uncured epoxy film having a curing temperature between about 80&#xb0; C. and about 300&#xb0; C. The uncured epoxy film can include a cresol novolac resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.

Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads

A coating for an ink jet printhead front face, wherein the coating comprises an oleophobic low adhesion coating having high thermal stability as indicated by less than about 15 percent weight loss when heated to up to 300&#xb0; C., and wherein a drop of ultra-violet (UV) gel ink or a drop of solid ink exhibits a contact angle of greater than about 50&#xb0; and sliding angle of less than about 30&#xb0; with a surface of the coating, wherein the coating maintains the contact angle and sliding angle after the coating has been exposed to a temperature of at least 260&#xb0; C. for at least 30 minutes.

Process for thermally stable oleophobic low adhesion coating for inkjet printhead front face

In accordance with the invention, there are image forming apparatuses, fuser members, and methods of making fuser members. The fuser member can include a substrate and an electrospun layer disposed over the substrate, the electrospun layer including a structure selected from a group consisting of a fiber-on-fiber structure, a bead-on-fiber structure, and a pop-corn structure, wherein the fuser member includes a top surface that is both hydrophobic and oleophobic.

Fabrication of large area, textured oil-less fusing/fixing surfaces by electrospinning technique

A method of making an ink jet print head front face or nozzle plate having a textured superoleophobic surface that prevents undesirable drooling, wetting and/or adhesion of the ink on the print head. The textured surface includes a rim formed around the nozzle. Also described are methods for forming the textured superoleophobic ink jet print head front face or nozzle plate from silicon having the textured, oleophobic surface.

Method for making an ink jet print head front face having a textured superoleophobic surface

A method for forming an ink jet printhead can include interposing a coverlay between a press plate of a press and an ink jet printhead aperture plate assembly, such that the coverlay physically contacts an anti-wetting coating on a surface of the aperture plate assembly. With the coverlay contacting the anti-wetting coating, a force is applied to the aperture plate assembly using the press. The coverlay is separated from the aperture plate assembly, wherein the coverlay includes a layer having an elastic modulus of at least 0.5 GPa.

Manufacturing process for an ink jet printhead including a coverlay

A coating for an ink jet printhead front face, wherein the coating comprises an oleophobic low adhesion coating having high thermal stability as indicated by less than about 15 percent weight loss when heated to up to 300&#xb0; C., and wherein a drop of ultra-violet (UV) gel ink or a drop of solid ink exhibits a contact angle of greater than about 45&#xb0; and sliding angle of less than about 30&#xb0; with a surface of the coating, wherein the coating maintains the contact angle and sliding angle after the coating has been exposed to a temperature of at least 200&#xb0; C. for at least 30 minutes.

A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks and pigmented inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Process for bonding interstitial epoxy adhesive for fabrication of printhead structures in high density printheads

Inkjet printheads containing a first plate, a second plate, and a cured adhesive composition disposed between and bonding the first plate and the second plate. The cured adhesive composition has a glass transition temperature of greater than about 115&#xb0; C. and is stable when exposed to acrylate monomer. Also, inkjet printheads having a first plate, a second plate, and a cured thin film adhesive disposed between and bonding to both of the first plate and the second plate. The cured thin film adhesive contains a polyimide film disposed between a cured first adhesive layer and a cured second adhesive layer. Methods of preparing such inkjet printheads.

Inkjet printheads containing epoxy adhesives and methods for fabrication thereof

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Webster, NY, United States of America

Hong Zhao