Honeywell International Inc.

Mcube, Inc.

Honeywell G.m.b.h.

Honewell Inc.

Hong Wan

Tamara K Bratland

William Frank Witcraft

Michael J Bohlinger

Lakshman Withanawasam

Michael L Freeman

Andrzej Peczalski

Ryan W Rieger

Xiao (Charles) Yang

Xiao “Charles” Yang

Anthony Francis Flannery, Jr

Jay R Goetz

Bharat B Pant

James F Detry

Edgar Robert Mallison

Raymond Merrill, Jr

Jon Ewanich

Dave Paul Jensen

Mark D Amundson

Cheisan J Yue

Ronald James Jensen

Chuck H Von Beck

Anthony D D'Angelo

Chesian J Yue

Charles H Von Beck

Lakshman S Wathanawasam

Michael J Behlinger

Ronald J Jensen

Lakshman S Withanawasam

A method and structure for a three-axis magnetic field sensing device. An IC layer having first bond pads and second bond pads can be formed overlying a substrate/SOI member with a first, second, and third magnetic sensing element coupled the IC layer. One or more conductive cables can be formed to couple the first and second bond pads of the IC layer. A portion of the substrate member and IC layer can be removed to separate the first and second magnetic sensing elements on a first substrate member from the third sensing element on a second substrate member, and the third sensing element can be coupled to the side-wall of the first substrate member.

Three axis magnetic sensor device and method using flex cables

A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one sensor or electronic device, formed on a die member, having contact region(s) with one or more conductive materials formed thereon. The resulting device can then be singulated within a vicinity of the contact region(s) to form one or more singulated dies, each having a singulated surface region. The singulated die(s) can be coupled to a substrate member, having a first surface region, such that the singulated surface region(s) of the singulated die(s) are coupled to a portion of the first surface region. Interconnections can be formed between the die(s) and the substrate member with conductive adhesives, solder processes, or other conductive bonding processes.

Method and structure of sensors and MEMS devices using vertical mounting with interconnections

A handheld device includes a housing, a display, a MEMS magnetic field sensor disposed within the housing, wherein the MEMS magnetic field sensor is configured to sense a plurality of perturbations in magnetic fields in response to a perturbation source when the user displaces the perturbation source proximate to the handheld device, and a processor disposed within the housing and coupled to the MEMS magnetic field sensor and to the display, wherein the processor is programmed to receive the plurality of perturbations in magnetic fields, wherein the processor is programmed to determine a plurality of spatial locations in at least two-dimensions in response to the plurality of perturbations, and wherein the processor is programmed output an indication of the plurality of spatial locations on the display.

Methods and apparatus for object tracking on a hand-held device

A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting is presented. The method includes providing a substrate having a surface region and forming sensor(s) or electronic device(s) on a first region overlying the surface region. At least one bond pad structure can be formed from at least one trench structure. The resulting device can then be singulated within a vicinity of the bond pad structure(s) to form at least one integrated sensor or electronic devices having at least one vertical bond pad. At least one singulated device(s) can be coupled to a package, having a package surface region, such that the vertical bond pad(s) are configured horizontally, and at least one interconnection can be formed between the vertical bond pad(s) and at least one portion of the package surface region.

Method and structure of sensors or electronic devices using vertical mounting

A method and structure for a three-axis magnetic field sensing device is provided. The device includes a substrate, an IC layer, and preferably three magnetic field sensors coupled to the IC layer. A nickel-iron magnetic field concentrator is also provided.

Three axis magnetic sensor device and method

A method to vertically bond a chip to a substrate is provided. The method includes forming a metal bar having a linear aspect on the substrate, forming a solder paste layer over the metal bar to form a solder bar, forming a plurality of metal pads on the substrate, and forming a solder paste layer over the plurality of metal pads to form a plurality of solder pads on the substrate. Each of the plurality of solder pads is offset from a long edge the solder bar by an offset-spacing. The chip to be vertically bonded to the substrate has a vertical-chip thickness fractionally less than the offset-spacing. The chip to be vertically bonded fits between the plurality of solder pads and the solder bar. The solder bar enables alignment of the chip to be vertically bonded.

Vertical sensor assembly method

A handheld device for capturing magnetic credit card data includes a MEMS magnetic field sensor disposed within the housing, wherein the MEMS magnetic field sensor is configured to determine a plurality of magnetic data stored on a magnetic stripe of a user provided media when the user disposes a user provided media proximate to the housing, and a processor disposed within the housing and coupled to the MEMS magnetic field sensor, wherein the processor is programmed to receive the plurality of user data stored on the user provided media, wherein the processor is configured to execute an application program, and wherein the processor is programmed to provide at least a subset of the plurality of user data to the application program.

Methods and apparatus for capturing magnetic credit card data on a hand held device

A computer implemented method for processing data stored on a magnetic stripe of a user medium performed by a hand-held computer system includes displaying an alignment GUI on a display of the computer system, wherein the GUI includes a visual alignment mark on the display at a first offset relative to a MEMS magnetic field sensor in the computer system, wherein when a user aligns the user medium to the alignment mark GUI, a portion of a first track of the magnetic stripe is disposed above the MEMS magnetic field sensor, sensing, by the MEMS magnetic field sensor, magnetic data stored on the first track when the user aligns the user medium to the visual alignment mark, and moves the user medium along the visual alignment mark, and determining user data stored on the first track from the magnetic data stored on the first track.

Methods and apparatus for facilitating capture of magnetic credit card data on a hand held device

A system and method for packaging a magnetic sensor is described. A sensor die is constructed such that connection pads are situated on two opposing sides of the die in two vertical arrays. Bonding wires connect the connection pads on the sensor die to wire bond pads on a substrate. Alternatively, the connection pads are connected to solderable chip pads on the substrate using flip chip bonding. Traces and vias are used to connect the wire bond pads or the solderable chip pads to sensor package pads. The sensor package pads are located on a single side of a sensor package for mounting on a next assembly. The next assembly has a land pattern that includes at least one leveling pad for positioning the sensor die perpendicular to the next assembly while being mounted and a single row of pads for making connections to the sensor package.

Low height vertical sensor packaging

A magnetic field sensing device can be realized by using a magnetic sensor in electronic compassing as well as switching. A magnet can be brought in close proximity to the magnetic sensor within an electronic compass to generate a signal that a portable information device has been closed. This signal can be input to a processor or other circuitry to initiate a response to the portable information device being closed. When the magnet is moved out of close proximity to the magnetic sensor, the magnetic sensor can be used in the electronic compass. Thus, a magnetic sensor can serve two functions, namely compassing and switching, reducing the need for separate sensors to perform both functions.

Magnetic field sensing device for compassing and switching

A multi-axis magnetic or other field sensing device and method of fabricating a multi-axis magnetic or other field sensing device. An example sensing device is a 3-axis sensor package on a substrate with sensors on opposing sides of the substrate. One side of the substrate includes an X-axis sensor and a Y-axis sensor (or alternatively an integrated X-Y-axis sensor) and the opposite side of the substrate includes a Z-axis sensor on at least one sloped surface, the surface sloped with respect to both the first and second surface areas. One surface is mechanically and electrically bonded to a circuit board via conductive bumps. The other surface electrically connects to the circuit board through bonded wires and/or vias formed through the substrate.

Integrated 3-axis field sensor and fabrication methods

Growing community of inventors

Plymouth, MN, United States of America

Hong Wan