Samsung Electronics Co., Ltd.

Hong-Sun Hwang

Chul-woo Park

Hak-soo Yu

In-gyu Baek

Jong-Pil Son

Sang-beom Kang

Chan-Kyung Kim

Joo-sun Choi

Dong-Hyun Sohn

Hyung-Rok Oh

Uk-Song Kang

Su-a Kim

Young-Hyun Jun

Kwan-Young Oh

Sang-Bo Lee

Sua Kim

Sang-Yun Kim

Jong-Hyun Choi

Chang-Hyun Kim

Dong-Min Kim

Won-Seok Lee

Sung-Ryul Kim

Yun-sang Lee

Soo-In Cho

Dae-je Chin

Jong-Hyoung Lim

Hyun-Ho Choi

Hyung-Shin Kwon

Ki-Won Park

Young-Kug Moon

Jin-hyoung Kwon

Joo-Sun Choi

Eun-sung Seo

Dong-Il Shu

Chung-Ki Lee

Chang-Yeong Jeong

A memory system includes at least one memory device and a memory controller. The at least one memory device includes a refresh request circuit that generates refresh request signals at timings based on data retention times of memory cells, such as based on individual data retention times of a memory cell row. The memory controller schedules operation commands for the at least one memory device in response to the received refresh request signals.

Memory devices providing a refresh request and memory controllers responsive to a refresh request

A method of operating a volatile memory device includes storing address information of weak cell rows. According to some examples, after writing to a weak cell row, a refresh operation is performed on the weak cell row within a predetermined time. According to some examples, the writing operation to a weak cell row may be performed with a longer write recovery time than a write recovery time to normal cell rows.

Method of operating a volatile memory device and a memory controller

Provided is a memory device having a first switch configured to receive a first CSL signal to input or output data. A second switch is configured to receive a second CSL signal. A sensing and latch circuit (SLC) is coupled between the first and second switches. And at least one memory cell is coupled to the second switch. The second switch is configured to control timing of read or write operations of the at least one memory cell in response to the second CSL signal, e.g., where a read operation can be performed in not more than about 5 ns. The SLC operates as a latch in a write mode and as an amplifier in a read mode. The memory device may comprise part of a memory system or other apparatus including such memory device or system. Methods of performing read and write operations using such memory device are also provided.

Memory device, method of performing read or write operation and memory system including the same

Volatile memory device and a memory controller

A memory device includes a cell array and a common source line compensation circuit. The cell array includes a plurality of normal cell units connected between a plurality of bit lines and one common source line, respectively. The common source line compensation circuit supplies a plurality of compensation write currents to the common source line to compensate for a plurality of write currents concurrently input into or output from the common source line through the normal cell units.

Common source semiconductor memory device

An anti-fuse circuit includes an array of anti-fuses. Each anti-fuse has a tunneling magneto-resistance (TMR) element series connected with a transistor, such that breakdown of a magnetic tunnel junction (MTJ) in response to an applied first voltage stores fuse information. A sensing circuit senses and amplifies respective output signals provided by the anti-fuses.

Anti-fuse circuit using MTJ breakdown and semiconductor device including same

A multiple well bias memory device that includes a semiconductor substrate; a first well of a first conductivity type formed in the semiconductor substrate and having a memory cell formed therein; and a second well of the first conductivity type formed in the semiconductor substrate and having formed therein a sense amplifier configured to sense and amplify data from the memory cell. The first and second wells have different doping concentrations and are biased to first and second voltages, respectively. The first voltage being lower than the second voltage.

Multiple well bias memory

A non-volatile memory device including a cell array, which includes a plurality of memory cells, and a sense amplification circuit. The sense amplification circuit is configured to receive a data voltage of a memory cell, a first reference voltage and a second reference voltage during a data read operation of the memory cell, generate differential output signals based on a voltage level difference between the data voltage and the first and second reference voltages, and output the differential output signals as data read from the memory cell.

Data read circuit, a non-volatile memory device having the same, and a method of reading data from the non-volatile memory device

A refresh method for a volatile memory device includes refreshing memory cells of a first set of rows of an array at a first refresh rate having a first refresh period, the first refresh rate being a lower rate having a longer refresh period than a second refresh rate having a second refresh period, wherein each memory cell in the first set of rows of the array has a retention time longer than the first refresh period; and refreshing memory cells of a second set of rows of the array at a third refresh rate having a third refresh period, the third refresh rate being a higher rate having a shorter refresh period than the second refresh rate having the second refresh period, wherein at least one memory cell of each row of the second set of rows has a retention time longer than the third refresh period and shorter than the first refresh period. The second refresh period corresponds to a refresh period defined in a standard for the volatile memory device.

Refresh method, refresh address generator, volatile memory device including the same

A semiconductor device includes a first memory region including a plurality of memory cells; a test unit configured to test the first memory region, and detect a weak bit from among the plurality of memory cells; and a second memory region configured to store a weak bit address (WBA) of the first memory region, and data intended to be stored in the weak bit, wherein the first memory region and the second memory region include different types of memory cells.

Semiconductor memory device capable of screening a weak bit and repairing the same

A semiconductor memory device having a 3D stacked structure includes: a first semiconductor area with a stacked structure of a first layer having first data and a second layer having second data; a first line for delivering an access signal for accessing the first semiconductor area; and a second line for outputting the first and/or second data from the first semiconductor area, wherein access timings of accessing the first and second layers are controlled so that a first time delay from the delivery of the access signal to the first layer to the output of the first data is substantially identical to a second time delay from the delivery of the access signal to the second layer to the output of the second data, thereby compensating for skew according to an inter-layer timing delay and thus performing a normal operation. Accordingly, the advantage of high-integration according to a stacked structure can be maximized by satisfying data input/output within a predetermined standard.

Three-dimensional semiconductor memory device having compensating data skewing according to interlayer timing delay and method of de-skewing data therein

A refresh address is generated with a refresh period for refreshing a memory device with refresh leveraging. A respective refresh is performed on a weak cell having a first address when the refresh address is a second address instead of on a first strong cell having the second address. A respective refresh is performed on one of the first strong cell or a second strong cell having a third address when the refresh address is the third address. Address information is stored for only one of the first, second, and third addresses such that memory capacity may be reduced. In alternative aspects, a respective refresh is performed on one of a weak cell, a first strong cell, or a second strong cell depending on a flag when the refresh address is any of at least one predetermined address to result in refresh leveraging.

Method of refreshing a memory device, refresh address generator and memory device

A semiconductor memory device is disclosed. The semiconductor memory device includes a memory array block, a first word line and a second word line. The memory array block includes a plurality of adjacent columns of memory cells, each column of memory cells including a plurality of consecutive memory cells having a plurality of respective consecutive cell transistors that comprise at least a first group of cell transistors and a second group of cell transistors. The first word line is disposed above the plurality of respective consecutive cell transistors and electrically connected to the first group of cell transistors, and the second word line is disposed below the plurality of respective consecutive cell transistors and electrically connected to the second group of cell transistors.

Semiconductor memory device including vertical channel transistors

A stacked semiconductor memory device comprises memory cell array layers that are stacked in an inverted wedge shape and have different redundancy sizes from each other. The stacked semiconductor memory device has space for vertical connection between layers, a relatively small size, and a relatively high yield.

Stacked memory device and method of repairing same

A memory device comprises a memory cell array and a bad page map. The memory cell array comprises a plurality of memory cells arranged in pages and columns, wherein the memory cell array is divided into a first memory block and a second memory block each corresponding to an array of the memory cells. The bad page map stores bad page location information indicating whether each of the pages of the first memory block is good or bad. A fail page address of the first memory block is replaced by a pass page address of the second memory block according to the bad page location information.

Growing community of inventors

Suwon-si, South Korea

Hong-Sun Hwang