Samsung Electro-mechanics Co., Ltd.

Hong Seok Kim

Jong Ho Lee

Chung Eun Lee

Jin Woo Kim

Chin Mo Kim

Hak Kwan Kim

Chang Hwa Park

Woo Sup Kim

Min Gi Sin

Chi Hwa Lee

Jae Yeol Choi

Doo Il Kim

Chang Sik Kim

Jin Su Park

Jong Hoon Kim

Chang Hak Choi

Doo Young Kim

Dong Hoon Kim

Dae Hee Lee

Jin Kyung Joo

Kyung Ryul Lee

Soo Kyong Jo

Eun Joo Choi

Seung Min Kang

Jin Ok Han

Dong Chan Kim

Ki Han Kim

Ji Ye Choi

Hee Soo Lee

Hye Bin Kim

Ah Young Shin

Eun Jeong Cho

Sun Ju Hwang

A multilayer electronic component includes a body including a dielectric layer including Ba and Ti and an internal electrode alternately disposed with the dielectric layer, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a side margin portion disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces, wherein the side margin portion includes Sn and a transition metal, and wherein, in the side margin portion, a mole ratio of transition metal to Sn is 10 or more.

Multilayer electronic component

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

Dielectric composition and multilayer ceramic capacitor containing the same

A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are provided and a plurality of internal electrodes are stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body and connected to the plurality of internal electrodes. The body includes a high resistance portion disposed in at least one region between the dielectric layer and the internal electrode and inside the dielectric layer and having electric resistance higher than electric resistance of the internal electrode, and the high resistance portion and the plurality of internal electrodes include the same metal component and the same metal oxide component.

Multilayer capacitor

A multilayer capacitor may include a capacitor body including an active area including a plurality of dielectric layers, and a plurality of first and second internal electrodes, upper and lower cover layers disposed on upper and lower surfaces of the active area, and having first to six external surfaces; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and a plurality of dummy electrodes disposed on the upper and lower cover layers with a dielectric layer interposed therebetween, and exposed through corners of the capacitor body, a portion of the plurality of dummy electrodes being disposed between the upper and lower surfaces of the capacitor body and the first and second band portions.

A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween, and first and second groove parts formed in first and second surfaces of the capacitor body opposing each other to extend in a first direction in which the dielectric layers are stacked, and contacting the first and second internal electrodes, respectively; and first and second via electrodes formed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.

Multilayer capacitor including via electrodes and board having the same

A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.

Multilayer ceramic electronic component including ceramic-metal compound layers

A multilayer ceramic electronic component may include a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on the active part, and a lower cover part disposed below the active part, a buffer layer disposed in at least one of the upper and lower cover parts, and external electrodes disposed on end surfaces of the ceramic body. The buffer layer may contain a conductive metal in a content of 1 to 40 vol %.

Multilayer ceramic electronic component and board for mounting thereof

There are provided a multilayer ceramic electronic component capable of preventing problems occurring due to a difference in sintering behavior between ceramic layers and internal electrodes and having excellent reliability, and a manufacturing method thereof. The multilayer ceramic electronic component may include a ceramic body including a plurality of ceramic layers; and internal electrodes disposed in the ceramic body. The internal electrodes may contain a conductive ceramic oxide.

Multilayer ceramic electronic component and manufacturing method thereof

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Suwon-si, South Korea

Hong Seok Kim