Industrial Technology Research Institute

Auo Display Plus Corporation

Au Optronics Corporation

Hong-Ming Chen

Yung-Jen Chen

Dong-Sing Wuu

Tzung-Rue Hsieh

Chia-Hung Chen

Chung-Kuan Ting

Fu-Ching Tung

Tzy-Ying Lin

Ren-Wei Huang

Jen-Rong Huang

Chia-Ming Chen

Chih-Kang Tung

Ten-Hsing Jaw

Wu-Lang Lin

Yi-Jing Wang

Peter L Mahneke

Lin-Wei Chiu

Chih-Cheng Huang

Janathan Wang

Hsiang-Chen Hsu

Kuo-Kang Tseng

A display includes an outer frame, a supporting frame, a display module, and a covering member. The supporting frame is accommodated in the outer frame. The display module is disposed on a supporting member of the supporting frame. The supporting member extends toward a display region of the display module from the supporting frame. On a first surface of the display module, a projection area of the supporting member and a projection area of an first optical film of the display module are partially overlapped with each other. A third surface of the covering member is closely attached to a second optical film of the display module. The covering member has an extension portion. The extension portion extends from a fourth surface opposite to the third surface toward a direction away from the third surface, and the extension portion is coplanar with the outer side surface of the outer frame.

Display

A backlight module includes a case body, supporting structures, light-emitting elements, and an optical module. The case body includes a first side wall and a second side wall opposite to the first side wall. Each of the support structures includes two supporting members and a bearing member. Two supporting members are respectively disposed on the first side wall and the second side wall. Each of the supporting member includes a fitting portion, an extending portion, and a bending portion. The fitting portion is fixed to the first side wall and the second side wall. The bearing member is disposed between the two supporting members. The light-emitting elements are respectively disposed on the bearing surface of the bearing member of the corresponding supporting structures. The optical module is disposed on the extending surface of the extending portion of each of the supporting structures. A display device is also provided.

Backlight module and display device having the same

A backlight module, a base used therein, and a manufacturing method thereof are provided. The backlight module includes a base and a slice-shaped circuit. The base has a back plate including a plate portion and a mezzanine portion. The mezzanine portion is parallelly offset from the plate portion, and the initial position of the mezzanine portion becomes an opening on the plate portion. Because the mezzanine portion is parallelly offset from the plate portion, a containing space is formed between an inner side of the mezzanine portion and the plane of the plate portion. A side of the mezzanine portion and a side of the plate portion corresponding to the opening together form a first slit. The slice-shaped circuit is inserted into the containing space through the first slit and stays between the plate portion and the mezzanine portion.

Backlight module with integrated base and method of manufacturing thereof

A display and a backlight module thereof. The display includes a backlight module, a panel and a front bezel. The backlight module includes a substrate, a plurality of lamps, and a plurality of lamp holders. The substrate includes a first side and a second side. The lamps are arranged from the first side to the second side in order and parallel to the first side and the second side. The lamp holders disposed on the substrate are connected to the lamps. A line formed by the linked lamps and the substrate intersect to form an included angle.

Display and backlight module thereof

A wafer backside protection apparatus includes a motor, a vacuum chuck, an annular seat and a top cover. The motor has an output shaft upon which the chuck is mounted. The chuck has a front surface to suck and hold a wafer from its backside. The chuck has a backside in which a water guard ring and a plurality of slant bores are formed. The slant bores run from the water guard ring through the wafer front surface. The annular seat is located below the chuck and has two symmetrical slant nozzles projecting toward motor rotating direction for ejecting protection liquid to the water guard ring. Protection liquid may be spun and splashed out through the slant bores to form a protection liquid film between the chuck and the wafer backside due to centrifugal force resulting from chuck and wafer rotation driven by the motor. The protection liquid film may protect wafer backside from chemical erosion and contamination resulting from wafer production process.

Wafer backside protection apparatus

A method of automatically coupling between a fiber and an optical waveguide is disclosed. Such a scheme is achieved by the property of the different etching rate in the various wafer direction on a semiconductor material, especial silicon, and the shrinking property of the glass soot formed by a flame hydrolysis deposition technique during a high temperature consolidation process, for improving aligning accuracy. The manufacturing process of the method is described below. First, a waveguide buffer layer is formed on a semiconductor substrate, then a waveguide layer is formed on the semiconductor substrate and the waveguide buffer layer. A part of the waveguide is manipulated to the planar optical waveguide, meanwhile, several windows which lead to the I/O end of the planar waveguide are formed on the other waveguide layer. The semiconductor substrate beneath the windows is etched anisotropically to form several aligning grooves. The lateral faces of these grooves and the surface of the semiconductor substrate can constitute a fixed angle.

Method of automatically coupling between a fiber and an optical waveguide

A method for fabricating planar lightwave circuits with at least one static-alignment fiber-guiding groove comprising the steps of: (a) fabricating a sandwiched Si-substrate by forming an etching stop layer on a first Si layer, followed by forming a second Si layer on the etching stop layer; (b) forming a waveguide layer on the Si-substrate, the waveguide layer containing at least one planar waveguide channel buried between a first cladding layer and a second cladding layer; (c) forming a photomask on the waveguide layer so as to allow the fiber-guiding grooves to be fabricated; (d) using the photomask and a first reactive ion etching procedure to form a first portion of the fiber-guiding groove, the first reactive ion etching procedure is controlled such that it etches through the waveguide layer and stops at the second Si layer; and (e) using the photomask and a second reactive ion etching procedure to form a second portion of the fiber-guiding groove, wherein the second reactive etching ion is selected in such a manner that the second reactive ion etching procedure etches only through the second Si layer and stops at the interface between the second Si layer and the etching stop layer. In a preferred embodiment, the etching stop layer comprises a glass material which is resistant to the second reactive etching ion, the fiber-guiding groove is a U-shaped groove, and the waveguide channel has a refractive index which differs from that of the first and second cladding layers by about 0.25%. The etching stop layer provides precise depth control and ensures the repeatibility of light coupling efficiency between the optical fiber and the waveguide, a critical element in lightwave circuits.

Fabrication of static-alignment fiber-guiding grooves for planar

Growing community of inventors

Hsinchu, Taiwan

Hong-Ming Chen