Samsung Electro-mechanics Co., Ltd.

Hong Kyu Shin

Wan Suk Yang

Jae Bum Cho

Hyun Cheol Oh

Jae Hyuk Choi

Hee Sung Choi

Hyun Sub Oh

Young June Lee

Yu Jin Choi

Hyun Ho Shin

Youn Soo Kim

Hun Chol Jung

Jeong Oh Hong

Hyoung Sun Ham

Kyoung Sup Choi

Sang Soo Park

Young Ghyu Ahn

Byoung Hwa Lee

Jin Ho Hong

Jeong Beom Hong

Jae Jun Park

Oh Choon Kwon

Seon Uk Hwang

Woo Sung Lee

Kyung Sup Choi

Choon Woo Lee

Ji Han Seo

A tantalum capacitor includes: a tantalum body including tantalum powder and having a tantalum wire exposed to one end surface; a molded portion having fifth and sixth surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and first and second direction opposing each other in a third direction, and disposed to surround the tantalum body; an anode lead frame exposed to the second surface of the molded portion and electrically connected to the tantalum wire; and a cathode lead frame spaced apart from the anode lead frame and exposed to the second surface of the molded portion. The anode lead frame includes a first connection portion and a first bent portion, and the first bent portion forms an angle of inclination, ranging from 70° or more to 80° or less, to a side of the tantalum body with respect to the first connection portion.

Tantalum capacitor

A tantalum capacitor includes: first and second surfaces facing in a first direction, third and fourth surfaces facing in a second direction, and fifth and sixth surfaces facing in a third direction; a tantalum body having one surface through which a tantalum wire is exposed in the first direction; and a substrate on which the tantalum body is mounted, wherein the substrate may be an organic-inorganic composite substrate.

Tantalum capacitor and manufacturing method thereof

A tantalum capacitor includes a capacitor body comprising a tantalum body having a tantalum wire and a molded portion; an anodic terminal connected to the tantalum wire and disposed on the first surface of the capacitor body; an anodic connection portion connected to the anodic terminal and disposed on the fifth surface of the capacitor body; a cathodic terminal connected to the tantalum body and disposed on the second surface of the capacitor body; a cathodic connection portion connected to the cathodic terminal and spaced apart from the anodic connection portion on the fifth surface of the capacitor body; and a substrate disposed on the sixth surface of the body and on which the tantalum body is mounted, wherein the anodic terminal and the cathodic terminal are electrically isolated on the substrate.

Tantalum capacitor having a substrate spaced apart from a mounting surface

An electronic component includes: a capacitor array including a plurality of tantalum capacitors arranged linearly; and a fixing member supporting a first surface and both side surfaces of the capacitor array so that the plurality of tantalum capacitors are not separated, wherein an area through which adjacent tantalum capacitors in the capacitor array are in contact with each other is 90% or more of an entire area of a corresponding surface of the adjacent tantalum capacitors.

Electronic component

A tantalum capacitor includes a tantalum body having a tantalum wire exposed from one surface; a positive electrode terminal including a first electrode portion connected to the tantalum wire and a second electrode portion connected to be perpendicular to the first electrode portion; wherein the first electrode portion includes a first protrusion disposed in a tantalum wire direction, and the tantalum wire includes a first groove disposed in a tantalum body direction, wherein the first groove and the first protrusion are connected to each other.

A tantalum capacitor includes a tantalum body, an encapsulation portion, first and second external electrodes spaced apart from each other on a lower surface of the encapsulation portion, a first plating layer disposed on one end surface of the encapsulation portion and a lower surface of the first external electrode to electrically connect the first external electrode and the tantalum body, an upper end of the first plating being comprised of a first bonding force improving portion contacting one upper edge of the encapsulation portion, and a second plating layer disposed on the other end surface of the encapsulation portion and a lower surface of the second external electrode to electrically connect the second external electrode and an exposed portion of a tantalum wire, an upper end of the second plating layer being comprised of a second bonding force improving portion contacting the other upper edge of the encapsulation portion.

A tantalum capacitor includes a tantalum body including tantalum powder, and having a tantalum wire exposed to one end surface; a molding portion including fifth and sixth surfaces opposed in a first direction, third and fourth surfaces opposed in a second direction, and first and second surfaces opposed in a third direction, and formed to surround the tantalum body; an anode lead frame exposed to the second surface of the molding portion, and connected to the tantalum wire; and a cathode lead frame spaced apart from the anode lead frame, and exposed to the second surface of the molding portion. The anode lead frame includes a first connection portion and a first bent portion, and the first bent portion forms an inclination angle within a range of less than 70&#xb0; toward the tantalum body, based on the first connection portion.

Tantalum capacitor including body and lead frame having bent portion forming inclination angle toward the body

A tantalum capacitor includes: a tantalum body comprising tantalum powder and a tantalum wire exposed to one end surface; an anode lead frame comprising a first electrode member and a second electrode member bent perpendicularly thereto; a cathode electrode lead frame comprising a third electrode member spaced apart from the first electrode member having the tantalum body mounted on an upper surface thereof and a fourth electrode member bent perpendicularly thereto; and a encapsulation portion covering the tantalum body so that lower surfaces of the first and third electrode members and one external surfaces of the second and fourth electrode members are exposed. The anode lead frame comprises a bend portion having a connection part of the first electrode member and the second electrode member as an axis, and an end of the bend portion is in contact with the tantalum wire.

A solid electrolytic capacitor includes a capacitor body including a sintered body of tantalum powders; an anode wire having a first region in a width direction embedded in the capacitor body and a second region in the width direction led through one surface of the capacitor body; an encapsulant part enclosing the capacitor body and the anode wire; an anode terminal disposed on an outer surface of the encapsulant part and connected to the anode wire; a cathode terminal spaced apart from the anode terminal and disposed on the outer surface of the encapsulant part; and a cathode lead portion electrically connecting the capacitor body and the cathode terminal to each other, wherein at least one of the anode wire and the cathode lead portion is provided in plural.

Solid electrolytic capacitor and board having the same

A tantalum capacitor includes a capacitor body; a tantalum wire protruding from one surface of the capacitor body; a molded part enclosing the capacitor body and the tantalum wire; an anode lead frame connected to the tantalum wire and exposed to an outer surface of the molded part; and a cathode lead frame disposed on an outer surface of the capacitor body and exposed to the outer surface of the molded part. The anode lead frame includes a bend portion.

Tantalum capacitor including an anode lead frame having a bent portion and method of manufacturing the same

There is provided a tantalum capacitor including: a tantalum capacitor body; a plurality of tantalum wires and an adhesive layer on a lower surface of the tantalum capacitor body; and a molding part enclosing the tantalum capacitor body, wherein the tantalum wire and the adhesive layer are connected to an anode lead frame and a cathode lead frame, respectively.

A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.

Composite electronic component, board having the same, and power smoother including the same

A tantalum capacitor includes a capacitor body containing tantalum powder, having a rectangular parallelepiped shape, and including a plurality of tantalum wires spaced apart from each other in a long axis direction of the rectangular parallelepiped shape and protruding from one side surface thereof perpendicular to the long axis direction; a conductive layer provided on one side surface of the capacitor body to be spaced apart from the tantalum wires; a sealing part enclosing the tantalum wires, the conductive layer, and the capacitor body and allowing end portions of the tantalum wires and a surface of the conductive layer to be exposed by the sealing part; an anode terminal provided on one side surface of the sealing part; and a cathode terminal provided on one side surface of the sealing part.

A composite electronic component includes a composite body having a multilayer ceramic capacitor and a tantalum capacitor coupled to each other, so as to have an excellent acoustic noise reduction effect, a low equivalent series resistance (ESR)/equivalent series inductance (ESL), improved direct current (DC)-bias characteristics, and a low chip thickness.

Composite electronic component and board having the same

A composite electronic component includes: a tantalum capacitor, a multilayer ceramic capacitor, a sealing part, an anode lead frame, and a cathode lead frame, wherein the anode lead frame includes a step portion that does not contact a first external electrode of the multilayer ceramic capacitor, and the cathode lead frame includes a step portion that does not contact a second external electrode of the multilayer ceramic capacitor.

Growing community of inventors

Suwon-si, South Korea

Hong Kyu Shin