Taiwan Semiconductor Manufacturing Comp. Ltd.

Hong-kun Chen

Shih-Yen Chen

Hui-Ting Lin

Chi-chun Peng

Chih-Yuan Chiu

A bonding tool and a bonding method are provided. The method includes attaching a semiconductor die to a bonding tool having a first surface, wherein the bonding tool comprises a bending member movably arranged in a trench of the bonding tool, and the bending member protrudes from the first surface and bends the semiconductor die; moving the semiconductor die toward a semiconductor wafer to cause a retraction of the bending member and a partial bonding at a portion of the semiconductor die and the semiconductor wafer; and causing a full bonding between the semiconductor die and the semiconductor wafer subsequent to the partial bonding.

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HSINCHU, Taiwan

Hong-kun Chen