Samsung Sdi Co., Inc.

Hong Jeong Yu

Dongjun Kim

Bumjin Lee

Jonggi Kim

Misun Kim

Hojeong Paek

Mi Jeong Choi

Minjee Park

Yonghee Kang

Jiho Lee

Dongju Shin

Jinsuop Youn

Jihyeon Yim

Young Woong Jang

Woo Jung Shin

Woo Han Kim

Byeonggeun Son

Doori Song

A photosensitive resin composition includes: (A) a binder resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) a quantum dot surface-modified with a compound having a thiol group at one terminal end and an alkoxy group, a cycloalkyl group, a carboxyl group, or a hydroxy group at the other terminal end; and (E) a solvent. A curable composition includes: (A') a resin; (B&#x2032;) a quantum dot surface-modified with a compound represented by Chemical Formula 1 or Chemical Formula 2; and (C&#x2032;) a solvent. A method of manufacturing the surface-modified quantum dot, and a color filter manufactured using the photosensitive resin composition or the curable composition are also disclosed.

Composition including quantum dot, manufacturing method quantum dot and color filter

Provided are a low temperature curing composition, a cured film obtained by curing the composition, and an electronic device comprising the cured film, wherein the composition comprises: (A) an epoxy group-containing siloxane compound represented by Chemical Formula 1:(RRRSiO)(RRSiO)(RSiO)(RRSiO)(RSiO)&#x2003;&#x2003;[Chemical Formula 1](In Chemical Formula 1, each of Rto Ris an organic group independently selected from a substituted or unsubstituted monovalent aliphatic hydrocarbon group of C1 to C6, a substituted or unsubstituted monovalent cycloaliphatic hydrocarbon group of C6 to C20, a substituted or unsubstituted monovalent aromatic hydrocarbon group of C6 to C20, and an epoxy-substituted monovalent organic group, at least one of R1 to R6 is an epoxy-substituted monovalent organic group, 0&#x2264;M&#x3c;1, 0&#x2264;D1&#x3c;1, 0&#x3c;T&#x2264;1, 0&#x2264;D2&#x3c;1, 0&#x2264;T2&#x3c;1, and M+D1+T1+D2+T2=1, wherein each of the structural units represented by M, D1, T1, D2, and T2 can include one or more types of different structural units); and (B) a cationic thermal initiator for a ring-opening reaction of epoxide, the initiator being a salt of a sulfonium-based cation and a borate-based anion, wherein the compound represented by chemical formula 1 is a combination of a siloxane 1,000 and a siloxane compound of which a number average molecular weight is in a range of 1,000-10,000.

Low temperature curing composition, cured film formed therefrom, and electronic device having cured film

Growing community of inventors

Suwon-si, South Korea

Hong Jeong Yu