Cisco Technology, Inc.

Hong Huynh

Vic Hong Chia

Robert Gregory Twiss

Steven Alf Hanssen

Saeed Seyed

Phillip S Ting

Susheela N Narasimhan

Frank S Jun

Michael Koken

Mandy Hin Lam

Michael Chern

Toan N Nguyen

Hsing-Sheng Liang

Mohammad Reza Danesh Kadivar

George Sya

M Baris Dogruoz

James Thomas Theodoras

Anthony King

Duong Cu Lu

Susheela Nanjunda Rao Narasimhan

Long Dang

David L Duell

Yewen Li

Daniel B Oliver

Yuan-Cheng Fang

Eric Michael Lotter

Sean Thomas

Long Huu Dang

A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

High impact resistant heat sink

A computing device comprises an air moving device operable to produce an airflow that removes heat from one or more components that are arranged upstream from the air moving device. The airflow corresponds to an acoustic energy signature. The computing device further comprises one or more mechanical drives that are arranged downstream from the air moving device, and a baffle comprising a first surface and an opposing second surface. The baffle is disposed between the air moving device and the one or more mechanical drives. The baffle defines a plurality of perforations extending between the first surface and the second surface, and the plurality of perforations are dimensioned and arranged to mitigate one or more predefined components of the acoustic energy signature of the airflow while permitting a first portion of the airflow to pass through the baffle to remove heat from the one or more mechanical drives.

Acoustic energy mitigation for mechanical drives using baffle

In one embodiment, a slot-filler blanking tray includes a vented blanking panel including a vented front panel, the vented blanking panel for fitting over an entrance to one slot of a computer equipment rack including support rails, and a panel arrangement including partition panels to form a slot partition for reversibly inserting into the one slot, supported by the support rails, the slot partition being formed either by unfolding the partition panels or fitting the partition panels together, wherein (a) the vented blanking panel and at least one partition panel of the partition panels are mechanically connected together, or (b) the vented blanking panel includes a first connecting element and the at least one partition panel includes a second connecting element to mechanically connect the vented blanking panel and the at least one partition panel together. Related apparatus and methods are also described.

Slot-filler blanking tray

A high insertion force ejector is provided. The high insertion force ejector includes an ejector mounting base, a pressure bar-ejector tooth, a first cam, and a second cam. The pressure bar-ejector tooth is connected to the ejector mounting base. A lever handle is operatively connected to the pressure bar-ejector and the ejector mounting base. The first cam and the second cam are operatively connected to the pressure bar-ejector tooth and the lever handle.

High insertion force ejector

An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.

Heat transfer for electronic equipment

A set of modular bracket units are mountable end-to-end in series on a support structure adjacent a cable interface area of an electronic equipment assembly, the form a composite cable management bracket. The bracket units are mountable in interchangeable positions in the series to define longitudinally extending series of segregated cable management openings through which cables are receivable for connection to respective electronic equipment ports, to restrain the cables against transverse escape from the respective cable management openings. The set of modular bracket units comprises at least one single-opening bracket unit that defines a single cable management opening, and at least one multi-opening bracket unit that defines, when mounted as part of the composite cable management bracket, two or more cable management openings. The bracket units that define different numbers of cable management openings are of equal modular length and has identical connection formations, to allow mounting of the bracket units in any desire sequence.

Modular cable management system

An enclosure has a perforated front door with a replaceable filter, and a perforated rear side allowing air to flow through the enclosure. The enclosure also has mounting brackets for heat generating elements, such as line cards or other rack mounted electronics. A fan draws air through the perforated front door, though the filter, and across the heat generating elements. Side brushes are disposed on a side wall near the front of the enclosure, which allow any cables attached to the heat generating elements to exit the enclosure. The front door is removable, opening up one side of the side brushes and allowing the cables to slide in the side brushes while still connected to the heat generating elements.

Air filtration and visual barrier for enclosure with front-to-back airflow

A latching apparatus provides selective injection and ejection of an electronic module relative to a chassis that includes a support member. The apparatus includes a housing to be coupled to the electronic module, and a handle pivotably coupled to the housing and movable between a latched position and an unlatched position. A catch in a first position retains the handle in the latched position. An actuator is coupled to the handle and operable to move the catch to a second position. In response to movement of the actuator in a direction the same as the direction of the handle toward the unlatched position, the catch is moved to its second position. As a result, the handle is movable between the latched and unlatched positions to permit the electronic module to be injected or ejected relative to the chassis.

Latching injector/ejector

A dual-cam ejector assembly for a card, such as a line card, is provided. The ejector assembly comprises an elongated ejector arm having its distal end coupled to the line card so as to provide a first axis of rotation for the ejector arm. The ejector assembly further comprises an ejector cam coupled to the line card so as to provide a second axis of rotation for the ejector cam. The ejector assembly also comprises a cam pin extending from the ejector cam that couples the ejector cam to the ejector arm such that pivoting of the ejector arm around the first axis of rotation causes the ejector cam to pivot around the second axis of rotation.

Dual-cam ejector assembly

To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.

Cooling arrangement for a rack mounted processing device

In one embodiment, the present disclosure refers to an apparatus comprising a bracket having a base configured to receive and hold a first electronic element. The bracket comprises at least one flange extending from the base and at least one guide acting to align the bracket and first electronic element with a second electronic element. The bracket also comprises at least one fastener aligned with the at least one guide and acting to engage and hold the second electronic element.

Aligning bracket

A heatsink attachment assembly includes a first anchor, a second anchor and a heatsink clip. The first anchor is configured to insert into a first hole in a circuit board in an upward direction from an underside of the circuit board toward a topside of the circuit board. Similarly, the second anchor is configured to insert into a second hole in the circuit board in the upward direction. The heatsink clip has (i) a first end configured to fasten to the first anchor when the first anchor is inserted into the first hole in the circuit board, (ii) a second end configured to fasten to the second anchor when the second anchor is inserted into the second hole in the circuit board, and (iii) a middle section configured to provide force on a heatsink in a downward direction which is substantially opposite the upward direction.

Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board

An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions configured to contact the circuit board. The heatsink attachment assembly further includes a heatsink clip configured to concurrently (i) fasten to the anchors when the anchors secure to the circuit board, and (ii) hold a heatsink to against a circuit board component of the circuit board. The looped end portions of the legs prevent the legs from completely passing through holes defined in the circuit board. In some situations, the looped end portions define extended coils (e.g., double loops) for a robust interference fit with the circuit board as well as for enhanced strength and stability.

Growing community of inventors

Fremont, CA, United States of America

Hong Huynh