Infineon Technologies Ag

Hong Hock Tay

Chee Yang Ng

Stefan Macheiner

Josef Maerz

Nurfarena Othman

Hock Siang Chua

Joseph Victor Soosai Prakasam

A semiconductor package includes a frame having an insulative body with a first main surface and a second main surface opposite the first main surface, a first plurality of metal traces at the first main surface, and a first cavity in the insulative body. A thermally and/or electrically conductive material filling the first cavity in the insulative body and having a different composition than the first plurality of metal traces. The thermally and/or electrically conductive material provides a thermally and/or electrically conductive path between the first and the second main surfaces of the insulative body. A semiconductor die attached to the frame at the first main surface of the insulative body is electrically connected to the first plurality of metal traces and to the thermally and/or electrically conductive material filling the first cavity in the insulative body. A corresponding method of manufacture is also described.

Growing community of inventors

Muar, Malaysia

Hong Hock Tay