Trinity International Industries, L.l.c.

Inventec Corp.

Alpha Omega Semiconductor Inc.

Sq Technology(shanghai) Corporation

Hong Fu

Cze-Chao Tam

Luke Chuang

Yuliang Li

Hamza Yilmaz

Jun Lu

Yueh-Se Ho

Yan Xun Xue

Zhiqiang Niu

Chaucer C Chiu

Yu Gong

Guo Feng Lian

An automatic spraying unmanned aerial vehicle (UAV) system based on dynamic adjustment of early warning range and a method thereof are disclosed. In the automatic spraying UAV system, an unmanned aerial vehicle analyzes a forward direction and a forward speed of a staff appearing in an environment video, calculates a preset distance, and generates an early-warning range by extending outwardly a spraying range by a preset distance; when determining the staff appears within the early-warning range in the environment video, the unmanned aerial vehicle pauses an automatic spraying operation, so as to achieve the technical effect of improving safety of the staff in an operation area by dynamically adjusting the early-warning range of the automatic spraying operation of the unmanned aerial vehicle.

Automatic spraying unmanned aerial vehicle system based on dynamic adjustment of early warning range, and method thereof

A fold-out cabinet includes a folding back panel that is pivotably attached to side panels so that the back panel can be sandwiched at least partially between the side panels when in a folded configuration. When unfolded, top and bottom panels are attached to complete the cabinet structure. The fold-out cabinet can be rapidly assembled and takes up a minimal footprint when packaged for storage, shipping or merchandising. Optional accessories may be included with the cabinet, including a workbench type top surface, one or more shelves, one or more drawers, and one or more doors. When assembled, the cabinet is structurally stable and functional, but requires little time for complete assembly.

Fold-out cabinet assembly

A wafer process for MCSP comprises: depositing a metal bump on bonding pads of chips; forming a first packaging layer at front surface of wafer covering metal bumps while forming an un-covered ring at the edge of wafer to expose the ends of each scribe line located between two adjacent chips; thinning first packaging layer to expose metal bumps; grinding back surface of wafer to form a recessed space and a support ring at the edge of the wafer; depositing a metal seed layer and a thick metal layer at bottom surface of wafer in recessed space in a sequence; cutting off the edge portion of wafer; and separating individual chips from wafer by cutting through first packaging layer, the wafer and the metal seed and metal layers along the scribe line.

Wafer process for molded chip scale package (MCSP) with thick backside metallization

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Shanghai, China

Hong Fu