Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Foxconn Technology Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Foxcomm Technology Co., Ltd.

Hong-Cheng Yang

Chun-Chi Chen

Min Li

Dong-Yun Li

Wei-Cheng Nie

Jin-Biao Liu

He-Ping Liu

Hong-Bo Shi

Cheng Kong

Xin-Lei Liu

A heat dissipation device includes a heat sink forming an engaging portion along an outer periphery thereof, a fan holder attached to the heat sink and a fan secured to the heat sink via the fan holder. The fan holder includes an elastic main body, a first clip pivotally connected to a free end of the elastic main body and a second clip connected with the first clip and engaging with an opposite free end of the elastic main body. The elastic main body includes a pair of fixing portions formed at upper and lower sides thereof. The lower fixing portion of the fan holder is tightly engaged with the engaging portion of the heat sink and the upper fixing portion presses the fan towards the heat sink when the second clip is tightly locked to the opposite free end of the elastic main body.

Heat dissipation device having a fan holder thereon

An exemplary heat dissipation device includes a heat sink, a fan holder, and a fan secured on a front side of the fan holder. The heat sink includes a base having two first fixing ears at its two lateral sides, and fins on the base. An engaging notch is defined in a top end of four of the fins. The fan holder includes a top panel, and two sidewalls extending downwardly from two lateral edges of the top panel. The top panel has a pair of inserting protrusions at a bottom surface thereof. The two sidewalls have two fixing flanges at lower ends thereof. The top panel is partially placed on the front portion of the top ends of the fins, and the inserting protrusions are inserted into the engaging notches of the fins. The two sidewalls abut against two lateral sides of the heat sink, and the two fixing flanges are disposed on the two first fixing ears.

Heat dissipation device having a fan holder

A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.

Heat dissipation device

A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.

A heat dissipation device includes a heat sink, a fan holder, and a fan secured on a front side of the fan holder. The heat sink includes a base and fins on the base. An engaging groove is defined in top ends of the fins. The fan holder includes a top panel and two sidewalls extending downwardly from two lateral edges of the top panel. The top panel has an inserting protrusion at a bottom surface thereof. The two sidewalls have two latching legs at lower ends thereof. The top panel is partially placed on a front portion of the top ends of the fins, and the inserting protrusion is inserted into the engaging groove of the fins. The two sidewalls abut against two lateral sides of the heat sink, and the two latching legs fasten to two lateral sides of the base of the heat sink.

A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.

Heat dissipation device and method for manufacturing the same

A heat dissipation device includes a heat sink having a plurality of fins, a fan holder attached to the heat sink and a fan mounted to the heat sink via the fan holder. The fan holder includes a plurality of separated brackets located at sides of the heat sink. Each bracket includes a plurality of mounting plates engaging with the fins of the heat sink and a plurality of elastic tabs formed on two opposite ends thereof. The fan is mounted on the fan holder by engaging with the elastic tabs.

A heat dissipation device includes a heat sink in which a plurality of mounting holes are defined, and a plurality of fasteners. Each of the fasteners includes a shaft with one end thereof received in a corresponding mounting hole, a sleeve enclosing the shaft and received in the mounting hole, and a fixture engaging the shaft and pressing the heat sink and a bottom end of the sleeve. The sleeve is filled between the end of the shaft and an inner face of the heat sink defining the mounting hole to perform an engagement of the shaft in the mounting hole of the heat sink, thereby fastening the fasteners to the heat sink. The shaft has a screw extending out of the mounting hole for mounting the heat sink on a printed circuit board.

A heat dissipation device includes a heat sink, a fan mounted on a top side of the heat sink, and a wire clip pivotally engaging with the heat sink and pressing the fan toward the heat sink. The heat sink includes a base, and a plurality of fins extending from the base. The fan includes a bracket. The clip includes a pivoting portion pivotally engaging with a fin of the heat sink, an engaging portion connecting with an end of the pivoting portion and an operating portion extending from another end of the pivoting portion. The operating portion is pressed downwardly to engage with the heat sink and to cause the engaging portion to rotate towards the fan and press the bracket of the fan toward the heat sink thereby securing the fan to the heat sink.

A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending towards the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.

Toolless locking device

A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base. The fins define a receiving channel therein, which is slantwise to two opposite sides of the heat sink. The clip includes a main body placed in the receiving channel and two latching legs extending obliquely and oppositely from two opposite ends of the main body. The two latching legs are located in front of and in rear of the two opposite sides of the heat sink, respectively, and are parallel thereto.

Heat dissipation device having a clip assembly

A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.

Heat dissipation device with heat pipe

A locking device used for locking a heat sink to an electronic device, includes two clips each having a clamping portion. The clamping portion of each has a first pressing portion, a second pressing portion spaced from and in alignment with the first pressing portion, and a catch depending between the first and second pressing portions. An operating portion extends from the second pressing portion of the clamping portion. The retention module includes a bottom with an opening defined therein, and two pairs of first and second clasps extending from the bottom for locking the two clips. When the retention module and the clips are in a locked position, the catches of the clips engage with the first clasps of the retention module, the operating portions engage with the second clasps of the retention module.

Locking device for heat sink

A heat sink has a base (), a plurality of fins () and a central receiving groove () in the fins. A first positioning portion () extends from a first fin at a side of the receiving groove and a positioning slot () is defined therein. The clip includes a main body () and a pair of legs (). The main body includes a retaining portion () and a first pressing portion (). The main body is received in the receiving groove and the first pressing portion is accommodated in the positioning slot. The retaining portion is offset from the first pressing portion. The legs can be pressed to securely connect with a printed circuit board (), whereby the heat sink can have an intimate contact with a CPU ().

Heat sink assembly

A fan holder () includes a base () for supporting a fan () thereon and a pair of locking members () pivotally connected to the base. Each of the locking members includes a pivot shaft () and a handle () extending perpendicularly from the pivot shaft. The pivot shaft includes a pivot section () and a pressing section () offsetting from the pivot section and spaced from the base, wherein the handle is capable of rotating about an axis of the pivot shaft to lock with the base and to cause the pressing section to exert a force against the fan toward the base to securely attach the fan to the base.

Growing community of inventors

Shenzhen, China

Hong-Cheng Yang