Elpida Memory, Inc.

Ps4 Luxco S.a.r.l.

Homare Sato

Junichi Hayashi

Kiyoshi Nakai

Shinichi Miyatake

Yuko Watanabe

Isamu Fujii

Such a device is disclosed that includes first and second chips stacked to each other, and a third chip controlling the first and second chips, stacked on the first and second chips, and including first, second and third output circuits. The first output circuit supplies a first command signal to the first chip. The second output circuit supplies the first command signal to the second chip. The third output circuit supplies a second command signal to the first and second chips.

Semiconductor device including plural chips stacked to each other

A method for accessing a plurality of DRAM devices each having a plurality of banks, includes determining an operating mode for the plurality of DRAM devices, providing a chip selection address and a bank address with an active command to activate a first bank in a first one of the plurality of DRAM devices and, while the first bank in the first one of the plurality of DRAM devices is activated, one or more first banks in remaining DRAM devices of the plurality of DRAM devices are: not activated if the operating mode is determined to be a logical rank address mode, and possibly activated if the operating mode is determined to be a physical rank address mode, and subsequently providing at least a bank address with a column command to access the first bank in the first one of the plurality of DRAM devices.

Disclosed herein is a semiconductor device that includes: a first circuit formed on a chip having a main surface; first to npenetration electrodes penetrating through the chip, where n is an integer more than 1; first to nmain terminals arranged on the main surface of the chip and vertically aligned with the first to npenetration electrodes, respectively, each of kmain terminal being electrically connected to k+1penetration electrode, where k is an integer more than 0 and smaller than n, and the nmain terminal being electrically connected to the first penetration electrode; a sub-terminal arranged on the main surface of the chip; and a selection circuit electrically connected to predetermined one of the first to nmain terminals, the sub-terminal, and the first circuit, wherein the selection circuit connects the first circuit to one of the predetermined main terminal and the sub-terminal.

Semiconductor device having penetration electrodes penetrating through semiconductor chip

To include a plurality of core chips to which different pieces of chip information from each other are given in advance. A first refresh command is divided into a plurality of second refresh commands having different timings from each other, and a refresh operation is performed on a core chip for which a count value of the second refresh commands and at least a portion of the chip information match each other. With this configuration, even when the second refresh command is commonly supplied to a plurality of core chips, it is possible to shift a timing for the refresh operation in each of the core chips. Therefore, it is possible to reduce a peak current at the time of the refresh operation.

Semiconductor memory device and data processing system

Such a device is disclosed that includes a first semiconductor chip including a plurality of first terminals, a plurality of second terminals, and a first circuit coupled between the first and second terminals and configured to control combinations of the first terminals to be electrically connected to the second terminals, and a second semiconductor chip including a plurality of third terminals coupled respectively to the second terminals, an internal circuit, and a second circuit coupled between the third terminals and the internal circuit and configured to activate the internal circuit when a combination of signals appearing at the third terminals indicates a chip selection.

A semiconductor device includes plural core chips and an interface chip that controls the plural core chips. Each of the plural core chips includes a layer address generating circuit that generates a second chip address by incrementing a value of a first chip address and a layer address comparing circuit that compares a third chip address supplied from the interface chip and the second chip address, and activates a chip selection signal when the third chip address and the second chip address are matched with each other. When a non-used chip signal is in an inactivated state, the layer address generating circuit supplies the second chip address to another core chip, and when the non-used chip signal is in an activated state, the layer address generating circuit supplies the first chip address to another core chip without a change.

Semiconductor device and information processing system including the same

A semiconductor memory device is provided in which a phase-change layer can be formed stably and electric current required to cause the phase change of the phase-change layer can be reduced. An edge portion of the phase-change layer is formed above a lower electrode. The edge portion is formed to assume a tapered shape in cross section such that the thickness of the phase-change layer varies above the contact area between the lower electrode and the phase-change layer. The tapered portion is filled with an oxide film. According to this configuration, the region in which the phase-change occurs can be restricted, and hence the phase-change layer can be heated efficiently, resulting in reduction of electric current required for heating.

Semiconductor memory device and manufacturing method thereof

A semiconductor device includes a plurality of signal lines which are arranged at a predetermined pitch; first and second MOS transistors which are connected to the signal lines, and also serially connected to each other; and a connection device which functions as a connection node between the serially-connected first and second MOS transistors, and connects a source area of one of the first and second MOS transistors to a drain area of the other of the first and second MOS transistors via contact holes, which are formed through an insulating layer, and a conduction layer connected to the contact holes.

Semiconductor device having MOS transistors which are serially connected via contacts and conduction layer

A non-volatile semiconductor memory device includes a plurality of lower electrodes arranged in a matrix manner, a plurality of recording layer patterns, each being arranged on the lower electrode, that contain a phase change material, and an interlayer insulation film that is provided between the lower electrode and the recording layer pattern and that has a plurality of apertures for exposing one portion of the lower electrode. The lower electrode and the recording layer pattern are connected in each aperture. The apertures extend in the X direction in parallel to one another. The recording layer patterns extend in the Y direction in parallel to one another. Thus the aperture can be formed with higher accuracy as compared to forming an independent aperture. Accordingly, high heating efficiency can be obtained while effectively preventing occurrence of poor connection or the like.

Electrically rewritable non-volatile memory element

A semiconductor memory device includes a plurality of active regions, and a gate electrode in a fish bone shape arranged on each active region. In each active region, a plurality of source regions and a plurality of drain regions are arranged in a matrix manner. The source regions are commonly connected to a source line, and the drain regions are each connected to a lower electrode of a different memory element. According to the present invention, it is possible to assign three cell transistors connected in parallel to one memory element, so that an effective gate width is further increased.

Growing community of inventors

Tokyo, Japan

Homare Sato