Infineon Technologies Ag

Siemens Aktiengesellschaft

Holger Poehle

Karl-Heinz Mueller

Christian Bretthauer

Karlheinz Mueller

Joern Plagmann

Momtchil Stavrev

Bernhard Laumer

A semiconductor die includes a last metallization layer above a semiconductor substrate, a bond pad above the last metallization layer, a passivation layer covering part of the bond pad and having an opening that defines a contact area of the bond pad, an insulating region separating the bond pad from the last metallization layer at least in an area corresponding to the contact area of the bond pad, and an electrically conductive interconnection structure that extends from the bond pad to the upper metallization layer outside the contact area of the bond pad. Corresponding methods of manufacture are also provided.

Semiconductor die bond pad with insulating separator

Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes a workpiece having a buried layer disposed beneath a top portion thereof. A trench is disposed in the workpiece extending at least through the buried layer. At least one sinker contact is disposed in the top portion of the workpiece. The at least one sinker contact is proximate sidewalls of at least a portion of the trench and is adjacent the buried layer. An insulating material is disposed on the sidewalls of the trench. A conductive material is disposed within the trench and is coupled to a lower portion of the workpiece.

Semiconductor devices and methods of manufacture thereof

In order to reduce an unevenness of a surface of a body, a sacrificial layer is applied to the surface, a chemical-mechanical polishing of the sacrificial layer and material of said body is performed to reduce the unevenness of the surface, and a remainder of the sacrificial layer, if any, may be removed.

Method for reducing an unevenness of a surface and method for making a semiconductor device

A pnp-type bipolar transistor includes a highly dop p-conducting emitter zone, a base zone and a buried n-conducting zone below the emitter zone. An additional p-conducting region is connected to the highly doped emitter zone and is disposed between the highly doped emitter zone and the buried zone. A collector zone includes a highly doped collector connection zone and a p-conducting region reaching from the collector connection zone to the buried zone.

Growing community of inventors

Taufkirchen, Germany

Holger Poehle